Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance electrical shorts may not occur at lower voltage levels. In these experiments, the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit was studied. From this data, the probability of an electrical short was estimated, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. Also, three tin whiskers grown from the...
Towards green technology application in electronic industry, pure tin as a Pb-free component lead fi...
Thesis (Ph. D.)--University of Rochester. Dept. of Mechanical Engineering, Materials Science Program...
The purpose of this study was to develop and validate a new surface defect counting procedure to be ...
Abstract—Existing risk simulations make the assumption that when a free tin whisker has bridged two ...
Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent ...
Pure electroplated tin is susceptible to the growth of fibrous whiskers that can produce short circu...
Tin whiskers are conductive crystal growths that form unpredictively from tin and tin alloy surfaces...
Pure tin is currently the most widely employed lead-free finish for plating of component terminals d...
Tin whiskers are filamentary growths that are formed on the surface of electrodeposited tin, which i...
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) al...
Tin, lead, and lead-tin solders are the most commonly used solders due to their low melting temperat...
Electroplated tin finishes are widely utilised in the electronics industry due to their advantageous...
Tin (Sn) whiskers are conductive Sn filaments that grow from Sn-plated surfaces, such as surface fin...
There is an establishment of whisker test methods as one of issues of Lead-free electric device. A T...
The effect of electric current on the tin whisker growth on Sn stripes was studied. The Sn stripes, ...
Towards green technology application in electronic industry, pure tin as a Pb-free component lead fi...
Thesis (Ph. D.)--University of Rochester. Dept. of Mechanical Engineering, Materials Science Program...
The purpose of this study was to develop and validate a new surface defect counting procedure to be ...
Abstract—Existing risk simulations make the assumption that when a free tin whisker has bridged two ...
Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent ...
Pure electroplated tin is susceptible to the growth of fibrous whiskers that can produce short circu...
Tin whiskers are conductive crystal growths that form unpredictively from tin and tin alloy surfaces...
Pure tin is currently the most widely employed lead-free finish for plating of component terminals d...
Tin whiskers are filamentary growths that are formed on the surface of electrodeposited tin, which i...
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) al...
Tin, lead, and lead-tin solders are the most commonly used solders due to their low melting temperat...
Electroplated tin finishes are widely utilised in the electronics industry due to their advantageous...
Tin (Sn) whiskers are conductive Sn filaments that grow from Sn-plated surfaces, such as surface fin...
There is an establishment of whisker test methods as one of issues of Lead-free electric device. A T...
The effect of electric current on the tin whisker growth on Sn stripes was studied. The Sn stripes, ...
Towards green technology application in electronic industry, pure tin as a Pb-free component lead fi...
Thesis (Ph. D.)--University of Rochester. Dept. of Mechanical Engineering, Materials Science Program...
The purpose of this study was to develop and validate a new surface defect counting procedure to be ...