Add to ORKGTwo common dielectrics used for isolation in semiconductor device fabrication, spin on glass (SOG) and polyimide, are evaluated for the fabrication of dielectric supported crossover interconnections for surface acoustic wave (SAW) devices employing three-phase unidirectional transducers (TPUDTs). An all-aluminium reliable fabrication process was developed using polyimide
System in a package (SIP) allows integrated circuit (ICs) modules or other components from different...
A novel reflector made from the highly unidirectional structure of the three-phase interdigital tran...
High-frequency Rayleigh-mode surface acoustic wave (SAW) devices were fabricated for 4G mobile telec...
Two common dielectrics used for isolation in semiconductor device fabrication, spin on glass (SOG) a...
Two common dielectrics used for isolation in semiconductor device fabrication, spin on glass (SOG) a...
Surface acoustic wave (SAW) devices were fabricated on Si to demonstrate functionality. Device desig...
A major part of the research on Love mode surface acoustic wave (SAW) is focused on using different:...
Additional contributors: Dr. Jong Noh, Yu Chen, Huan Li, Dr. Mo Li (faculty mentor)Surface acoustic ...
Research into surface acoustic wave (SAW) devices began in the early 1970s and led to the developmen...
This thesis presents an introduction into surface acoustics wave (SAW) unidirectional transducer (UD...
A novel reflector made from the highly unidirectional structure of the three-phase interdigital tran...
This paper will review the evolution of SAW transducer technology for communication systems. Applica...
Research into surface acoustic wave (SAW) devices began in the early 1970s and led to the developmen...
AbstractWe investigate high-performance interdigital transducers (IDTs) for the generation of surfac...
Since their invention in the mid-1960's, surface acoustic wave (SAW) devices have become popular for...
System in a package (SIP) allows integrated circuit (ICs) modules or other components from different...
A novel reflector made from the highly unidirectional structure of the three-phase interdigital tran...
High-frequency Rayleigh-mode surface acoustic wave (SAW) devices were fabricated for 4G mobile telec...
Two common dielectrics used for isolation in semiconductor device fabrication, spin on glass (SOG) a...
Two common dielectrics used for isolation in semiconductor device fabrication, spin on glass (SOG) a...
Surface acoustic wave (SAW) devices were fabricated on Si to demonstrate functionality. Device desig...
A major part of the research on Love mode surface acoustic wave (SAW) is focused on using different:...
Additional contributors: Dr. Jong Noh, Yu Chen, Huan Li, Dr. Mo Li (faculty mentor)Surface acoustic ...
Research into surface acoustic wave (SAW) devices began in the early 1970s and led to the developmen...
This thesis presents an introduction into surface acoustics wave (SAW) unidirectional transducer (UD...
A novel reflector made from the highly unidirectional structure of the three-phase interdigital tran...
This paper will review the evolution of SAW transducer technology for communication systems. Applica...
Research into surface acoustic wave (SAW) devices began in the early 1970s and led to the developmen...
AbstractWe investigate high-performance interdigital transducers (IDTs) for the generation of surfac...
Since their invention in the mid-1960's, surface acoustic wave (SAW) devices have become popular for...
System in a package (SIP) allows integrated circuit (ICs) modules or other components from different...
A novel reflector made from the highly unidirectional structure of the three-phase interdigital tran...
High-frequency Rayleigh-mode surface acoustic wave (SAW) devices were fabricated for 4G mobile telec...