In order to evaluate the crystallinity of the Si epitaxial layer on a recently developed 400mm diameter wafer, detailed transmisson electron microscopic observations were carried out, using specimens with the following growth conditions; growth temperature at 900℃, the H_2 gas flow rate of 80slm and the SiH_4 gas flow rate of 300sccm. V-shaped micro defects, which basically consisted of stacking faults and micro twins, were observed in the epitaxial layer. The morphology and distribution of the defects depended on the positions on the wafer, i. e. the distance from the wafer edge. Mechanisms of defect formation are briefly discussed
De récents travaux consacrés à l’étude des propriétés des matériaux aux petites échelles ont soulign...
As device geometries shrink and customer demands for more stringent zero-defect imagers increases, e...
Dans cet article, sont présentés des résultats d'une étude par microscopie électronique en transmiss...
Abstract The structure and morphology of epitaxial layer defects in epitaxial Si wafers produced by ...
Single crystals for 300 mm wafer are grown by horizontal magnetic Czochralski method. 300mm wafers a...
In recent years epitaxially grown wafers (EpiWafers) made their way from small laboratory to product...
Modern microelectronic device manufacture requires single-crystal silicon substrates of unprecedente...
A novel process for low-temperature (LT) epitaxial growth of silicon carbide (SiC) by replacing the ...
The control and characterisation of wafer defect and strain distributions is of crucial importance f...
Microdefects in wafers sliced from selected positions along Czochralski (CZ)-grown, silicon single c...
In this work, nanocavities at R_P/2 are observed directly by TEM analysis. The evolution of these va...
The continued decrease in critical dimensions and increasing integration levels in Si CMOS technolog...
A simulation of a cold technology (< 950 °C) has been analysed by X-ray topography at different stag...
Defects of silicon (Si) semiconductor epilayers are crucial to be identified at laboratory environs....
The material quality degradation of silicon wafers by metal impurities, various crystal defects as w...
De récents travaux consacrés à l’étude des propriétés des matériaux aux petites échelles ont soulign...
As device geometries shrink and customer demands for more stringent zero-defect imagers increases, e...
Dans cet article, sont présentés des résultats d'une étude par microscopie électronique en transmiss...
Abstract The structure and morphology of epitaxial layer defects in epitaxial Si wafers produced by ...
Single crystals for 300 mm wafer are grown by horizontal magnetic Czochralski method. 300mm wafers a...
In recent years epitaxially grown wafers (EpiWafers) made their way from small laboratory to product...
Modern microelectronic device manufacture requires single-crystal silicon substrates of unprecedente...
A novel process for low-temperature (LT) epitaxial growth of silicon carbide (SiC) by replacing the ...
The control and characterisation of wafer defect and strain distributions is of crucial importance f...
Microdefects in wafers sliced from selected positions along Czochralski (CZ)-grown, silicon single c...
In this work, nanocavities at R_P/2 are observed directly by TEM analysis. The evolution of these va...
The continued decrease in critical dimensions and increasing integration levels in Si CMOS technolog...
A simulation of a cold technology (< 950 °C) has been analysed by X-ray topography at different stag...
Defects of silicon (Si) semiconductor epilayers are crucial to be identified at laboratory environs....
The material quality degradation of silicon wafers by metal impurities, various crystal defects as w...
De récents travaux consacrés à l’étude des propriétés des matériaux aux petites échelles ont soulign...
As device geometries shrink and customer demands for more stringent zero-defect imagers increases, e...
Dans cet article, sont présentés des résultats d'une étude par microscopie électronique en transmiss...