科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2) ・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究
In this article we report the results of the scanning tunneling microscope study of the surface morp...
Recently Al was replaced by Cu as an interconnecting material. The primary objective of the present ...
In the rapidly developing semiconductor industry, sputter deposition is the most widely used metalli...
科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2) ・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究
科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2)・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究
International audienceCopper-copper direct bonding is a fundamental procedure in three-dimensional i...
Author name used in this publication: C. H. Woo2001-2002 > Academic research: refereed > Publication...
科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2) ・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究
Stress and resistivity in sputtered copper films on glass and polyimide (Kapton H) substrates were s...
Texture in films develops during deposition processes and annealing of patterned wafers. Recent stud...
Author name used in this publication: C. H. Woo2002-2003 > Academic research: refereed > Publication...
textThermomechanical stresses in the copper interconnects are directly related to void formation an...
Apart from the scientific interest, texture development in copper thin films is of crucial importanc...
textThermal stress and mass transport are key issues for Cu metallization yield and reliability. In...
International audienceIn 3D integration industrial context, copper is widely favored over othersmeta...
In this article we report the results of the scanning tunneling microscope study of the surface morp...
Recently Al was replaced by Cu as an interconnecting material. The primary objective of the present ...
In the rapidly developing semiconductor industry, sputter deposition is the most widely used metalli...
科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2) ・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究
科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2)・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究
International audienceCopper-copper direct bonding is a fundamental procedure in three-dimensional i...
Author name used in this publication: C. H. Woo2001-2002 > Academic research: refereed > Publication...
科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2) ・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究
Stress and resistivity in sputtered copper films on glass and polyimide (Kapton H) substrates were s...
Texture in films develops during deposition processes and annealing of patterned wafers. Recent stud...
Author name used in this publication: C. H. Woo2002-2003 > Academic research: refereed > Publication...
textThermomechanical stresses in the copper interconnects are directly related to void formation an...
Apart from the scientific interest, texture development in copper thin films is of crucial importanc...
textThermal stress and mass transport are key issues for Cu metallization yield and reliability. In...
International audienceIn 3D integration industrial context, copper is widely favored over othersmeta...
In this article we report the results of the scanning tunneling microscope study of the surface morp...
Recently Al was replaced by Cu as an interconnecting material. The primary objective of the present ...
In the rapidly developing semiconductor industry, sputter deposition is the most widely used metalli...
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