Track registration properties in polyimide films, KAPTON, for heavy ions have been examined by means of FT-IR spectrometry and the chemical etching in sodium hypochlorite solution. The effective track core size for the loss of C]O and CeNeC composing imide bonds, and diphenyl ethers of CeOeC have been evaluated under the irradiations by Ne, Fe and Xe ions at energies less than 6 MeV/n. On the other hand, the etching property of the polyimide films has been examined in the sodium hypochlorite solution at temperature of 55 C. Before the etchings, the films were exposed to H, C, Ne, Fe and Xe ions, at incident energies below 6 MeV/n. The etch pits are found only on the films exposed to Fe and Xe ions, indicating significant difference on the ...
We modify the electrical properties of polyimide (PI) films by irradiation with 80 keV Xe ions. The ...
The damage structure of latent tracks in poly(ethylene terephthalate) (PET) has been examined by Fou...
Surface modification techniques such as wet chemical etching, oxidizing flames, and plasma treatment...
Threshold of etchable track registration in Polyimide films, KAPTON, has been examined through both ...
The damage structure of latent tracks in Polyimide (PI) films, KAPTON and UPILEX, has been examined ...
The track registration property in polyimide Kapton has been examined for heavy ions, including 2.3G...
Polyimide films of thickness 7.5 µm are irradiated by a wide range of ions (1H to 197Au) with energi...
Polyimide films of thickness 7.5 µm are irradiated by a wide range of ions (1H to 197Au) with energi...
66-70 High energy heavy ion irradiation effect on surface chemical etching behaviour of kapt...
563-568FTIR spectroscopy technique has been applied for the analysis of high energy heavy ion irradi...
Polyimide thin films have been irradiated with a high energy beam of heavy ions to a fluence of appr...
Polyimide thin films have been irradiated with a high energy beam of heavy ions to a fluence of appr...
The differences in the radiation durabilities of two polyimide materials, Du Pont Kapton and General...
The effect of Cu 3+ ion-beam irradiation on the microstructure of two polyimide ( PI ) films ( PMDA...
Structures of polyimide (6051) films modified by irradiation of 2.0 MeV Si ions with different fluen...
We modify the electrical properties of polyimide (PI) films by irradiation with 80 keV Xe ions. The ...
The damage structure of latent tracks in poly(ethylene terephthalate) (PET) has been examined by Fou...
Surface modification techniques such as wet chemical etching, oxidizing flames, and plasma treatment...
Threshold of etchable track registration in Polyimide films, KAPTON, has been examined through both ...
The damage structure of latent tracks in Polyimide (PI) films, KAPTON and UPILEX, has been examined ...
The track registration property in polyimide Kapton has been examined for heavy ions, including 2.3G...
Polyimide films of thickness 7.5 µm are irradiated by a wide range of ions (1H to 197Au) with energi...
Polyimide films of thickness 7.5 µm are irradiated by a wide range of ions (1H to 197Au) with energi...
66-70 High energy heavy ion irradiation effect on surface chemical etching behaviour of kapt...
563-568FTIR spectroscopy technique has been applied for the analysis of high energy heavy ion irradi...
Polyimide thin films have been irradiated with a high energy beam of heavy ions to a fluence of appr...
Polyimide thin films have been irradiated with a high energy beam of heavy ions to a fluence of appr...
The differences in the radiation durabilities of two polyimide materials, Du Pont Kapton and General...
The effect of Cu 3+ ion-beam irradiation on the microstructure of two polyimide ( PI ) films ( PMDA...
Structures of polyimide (6051) films modified by irradiation of 2.0 MeV Si ions with different fluen...
We modify the electrical properties of polyimide (PI) films by irradiation with 80 keV Xe ions. The ...
The damage structure of latent tracks in poly(ethylene terephthalate) (PET) has been examined by Fou...
Surface modification techniques such as wet chemical etching, oxidizing flames, and plasma treatment...