Numerical simulations of the gate leakage current in metal-insulator-semiconductor (MIS) structures based on the transfer matrix approach were carried out. They show contribution of different components of this current in MIS structures with best known high-k dielectrics such as Ta2O5 and TiO2. The comparison of the gate leakage current in MIS structures with SiO2 layer as well Ta2O5 and TiO2 layers is presented as well. Additionally, the minimum Si electron affinity to a gate dielectric which allows to preserve given level of the gate leakage current is proposed
An effective model to evaluate the leakage currents for different stacked gates deep submicron MOS t...
Scaling down of MOS device dimensions is accompanied by a decrease in gate-oxide thickness and an in...
This work examines the suitability of both ultrathin Silicon Oxynitride (SiON) and Hafnium Silicate ...
In this paper we present an integral physical model for describing electrical and dielectric propert...
Gate leakage of deep-submicron MOSFET with stack high-k dielectrics as gate insulator is studied by ...
International audienceIn this paper, we present a one-dimensional (1D) simulation study of gate leak...
This paper reveals the use of high-k dielectric material to mitigate the subthreshold leakage curren...
Modeling of the leakage current in a field-effect transistor metal-oxide-semiconductor (MOSFET) with...
Since 45nm node, the replacement of conventional SiO2 oxide by a high-permittivity dielectric has be...
Since 45nm node, the replacement of conventional SiO2 oxide by a high-permittivity dielectric has be...
Since 45nm node, the replacement of conventional SiO2 oxide by a high-permittivity dielectric has be...
"Increased power dissipation is one of the major issue for today’s chip designers. Gate leakage acro...
An effective model to evaluate the leakage currents for different stacked gates deep submicron MOS t...
This work examines the suitability of both ultrathin Silicon Oxynitride (SiON) and Hafnium Silicate ...
This work examines the suitability of both ultrathin Silicon Oxynitride (SiON) and Hafnium Silicate ...
An effective model to evaluate the leakage currents for different stacked gates deep submicron MOS t...
Scaling down of MOS device dimensions is accompanied by a decrease in gate-oxide thickness and an in...
This work examines the suitability of both ultrathin Silicon Oxynitride (SiON) and Hafnium Silicate ...
In this paper we present an integral physical model for describing electrical and dielectric propert...
Gate leakage of deep-submicron MOSFET with stack high-k dielectrics as gate insulator is studied by ...
International audienceIn this paper, we present a one-dimensional (1D) simulation study of gate leak...
This paper reveals the use of high-k dielectric material to mitigate the subthreshold leakage curren...
Modeling of the leakage current in a field-effect transistor metal-oxide-semiconductor (MOSFET) with...
Since 45nm node, the replacement of conventional SiO2 oxide by a high-permittivity dielectric has be...
Since 45nm node, the replacement of conventional SiO2 oxide by a high-permittivity dielectric has be...
Since 45nm node, the replacement of conventional SiO2 oxide by a high-permittivity dielectric has be...
"Increased power dissipation is one of the major issue for today’s chip designers. Gate leakage acro...
An effective model to evaluate the leakage currents for different stacked gates deep submicron MOS t...
This work examines the suitability of both ultrathin Silicon Oxynitride (SiON) and Hafnium Silicate ...
This work examines the suitability of both ultrathin Silicon Oxynitride (SiON) and Hafnium Silicate ...
An effective model to evaluate the leakage currents for different stacked gates deep submicron MOS t...
Scaling down of MOS device dimensions is accompanied by a decrease in gate-oxide thickness and an in...
This work examines the suitability of both ultrathin Silicon Oxynitride (SiON) and Hafnium Silicate ...