Co-deposition of CuO and Mn1.5Co1.5O4by single step electrophoretic deposition is used to produce15mm coatings on Crofer22APU steel, which finds use as interconnect for high temperature solid oxide cells.Sintering of the green coatings in reducing and then oxidizing conditions led to formation of a mixed (Cu,Mn,Co)3O4spinel. By the incorporation of Cu, the density of the coatings improved. Scanning and trans-mission electron microscopy observations, supplemented with energy dispersive spectroscopy, con-firmed dissolution of Cu in the spinel phase. For the un-doped Mn1.5Co1.5O4both the tetragonal andcubic phases are detected at room temperature by X-ray diffractometry, whereas the addition of Cuseems to stabilize the cubic phase. Initial (10...
This paper seeks to examine how the Mn–Co spinel interconnect coating microstructure can influence C...
Cr-containing stainless steels are widely used as metallic interconnects for SOFCs. Volatile Cr-cont...
Based on the stability range of the CuxMn3-x04 solid solution, two different preparation methods for...
The Cu doping of the Mn–Co spinel is obtained “in-situ” by electrophoretic co-deposition of CuO and ...
A novel cobalt-free Cu1.2Mn1.8O4 spinel coating is prepared and evaluated for the metal interconnect...
Fe-doped Mn1,5Co1,5O4 coatings on Crofer22APU were processed by an electrophoretic co-deposition met...
MnCo2O4, MnCo1.7Cu0.3O4 and MnCo1.7Fe0.3O4 are investigated as coatings for corrosion protection of ...
Manganese cobaltite-based spinel coatings have been reported to effectively limit oxidation and Cr-e...
To prevent Cr poisoning of the cathode and to retain high conductivity during solid oxide fuel cell ...
Mn-Co Spinel is considered as one of the most promising materials for the interconnect protection of...
We report a systematic microstructural and electrical characterization of iron doped Mn–Co spinel co...
Ceramic coatings for metallic interconnects play a key role in limiting corrosion and chromium evapo...
Metallic interconnects in intermediate temperature solid oxide fuel cells (IT-SOFC) stacks form Cr2O...
Protective coatings based on manganese cobalt oxide spinels are required in solid oxide fuel cells (...
Cu-Mn alloy films are electrodeposited on Au substrates as precursor alloys for the synthesis of fin...
This paper seeks to examine how the Mn–Co spinel interconnect coating microstructure can influence C...
Cr-containing stainless steels are widely used as metallic interconnects for SOFCs. Volatile Cr-cont...
Based on the stability range of the CuxMn3-x04 solid solution, two different preparation methods for...
The Cu doping of the Mn–Co spinel is obtained “in-situ” by electrophoretic co-deposition of CuO and ...
A novel cobalt-free Cu1.2Mn1.8O4 spinel coating is prepared and evaluated for the metal interconnect...
Fe-doped Mn1,5Co1,5O4 coatings on Crofer22APU were processed by an electrophoretic co-deposition met...
MnCo2O4, MnCo1.7Cu0.3O4 and MnCo1.7Fe0.3O4 are investigated as coatings for corrosion protection of ...
Manganese cobaltite-based spinel coatings have been reported to effectively limit oxidation and Cr-e...
To prevent Cr poisoning of the cathode and to retain high conductivity during solid oxide fuel cell ...
Mn-Co Spinel is considered as one of the most promising materials for the interconnect protection of...
We report a systematic microstructural and electrical characterization of iron doped Mn–Co spinel co...
Ceramic coatings for metallic interconnects play a key role in limiting corrosion and chromium evapo...
Metallic interconnects in intermediate temperature solid oxide fuel cells (IT-SOFC) stacks form Cr2O...
Protective coatings based on manganese cobalt oxide spinels are required in solid oxide fuel cells (...
Cu-Mn alloy films are electrodeposited on Au substrates as precursor alloys for the synthesis of fin...
This paper seeks to examine how the Mn–Co spinel interconnect coating microstructure can influence C...
Cr-containing stainless steels are widely used as metallic interconnects for SOFCs. Volatile Cr-cont...
Based on the stability range of the CuxMn3-x04 solid solution, two different preparation methods for...