This paper presents the design, FEM modeling and experimental characterization of the elastic-plastic behavior of electroplated gold specimens undergoing tensile loading. The test structures are designed and optimized to achieve high stress values in the double-clamped specimen with a rectangular crosssection in the middle of the test structure. High stresses in the specimen are achieved by using electrostatic actuation to the plates, constrained using hinges. The range of electrostatic actuation is increased using bottom partial-plate electrodes on the substrate. The static deflection of the central specimen in the test structures under multiple loading cycles is obtained using experimental characterization and a change in the s...
Abstract MEMS-based tensile testing devices are powerful tools for mechanical characterization of na...
A novel set of microstructures for on-wafer stress measurement is prensented, based on a lancet prin...
This paper proposes a new strategy for detecting material strength loss under mechanical fatigue on ...
This paper presents the design, FEM modeling and experimental characterization of the elastic-plasti...
This paper presents the experimental characterization of elastic–plastic behavior of the thin gold m...
This paper presents a simple design of gold MEMS, with a central test specimen undergoing tensile lo...
This paper investigates the effect of stress and strains concentration, due to the notch presence, o...
Mechanical properties of freestanding electroplated gold thin films were studied in relationship to ...
Mechanical properties of freestanding electroplated gold thin films were studied ...
International audienceMechanical properties of freestanding electroplated gold thin films were studi...
Modeling of gold microbeams for characterizing MEMS packaging solutions in terms of strains induced ...
This paper presents the simulation of specifically MEMS specimen in the presence of stress concentra...
This study is focused on the mechanical characterization of materials used in microelectronic and mi...
This work presents the characterization of the stress-strain behavior of an electroplated gold layer...
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)Interna...
Abstract MEMS-based tensile testing devices are powerful tools for mechanical characterization of na...
A novel set of microstructures for on-wafer stress measurement is prensented, based on a lancet prin...
This paper proposes a new strategy for detecting material strength loss under mechanical fatigue on ...
This paper presents the design, FEM modeling and experimental characterization of the elastic-plasti...
This paper presents the experimental characterization of elastic–plastic behavior of the thin gold m...
This paper presents a simple design of gold MEMS, with a central test specimen undergoing tensile lo...
This paper investigates the effect of stress and strains concentration, due to the notch presence, o...
Mechanical properties of freestanding electroplated gold thin films were studied in relationship to ...
Mechanical properties of freestanding electroplated gold thin films were studied ...
International audienceMechanical properties of freestanding electroplated gold thin films were studi...
Modeling of gold microbeams for characterizing MEMS packaging solutions in terms of strains induced ...
This paper presents the simulation of specifically MEMS specimen in the presence of stress concentra...
This study is focused on the mechanical characterization of materials used in microelectronic and mi...
This work presents the characterization of the stress-strain behavior of an electroplated gold layer...
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)Interna...
Abstract MEMS-based tensile testing devices are powerful tools for mechanical characterization of na...
A novel set of microstructures for on-wafer stress measurement is prensented, based on a lancet prin...
This paper proposes a new strategy for detecting material strength loss under mechanical fatigue on ...