In this article, the design of a dual-band PA developed in SiGe HBT technology and its system level investigation are presented. Starting from an extensive nonlinear characterization at the device level, by which the optimum load conditions was inferred, an optimized amplifier capable to operate simultaneously at 2.45 and 3.5 GHz was designed. The designed amplifier exhibits in single-band mode operation 9.3 dBm and 13.4 dBm output power (1 dB compression point) at 2.45 GHz and 3.5 GHz, respectively. When working under simultaneous channel amplifications, an higher reduction of the 1 dB compression point at 3.5 GHz, compared with the one at 2.45 GHz, is observed; this reflects in a more significant degradations of system level performance s...
Recent developments of millimeter-wave BiCMOS multiband amplifiers including 0.18-µm SiGe BiCMOS con...
This thesis discusses the design, fabrication, and testing of a high efficiency, dual band radio fre...
The performances of WR-3.4 monolithic amplifiers fabricated using dual-finger 6 µm InP HBT devices a...
In this article, the design of a dual-band PA developed in SiGe HBT technology and its system level ...
In this article, the design of a dual-band PA developed in SiGe HBT technology and its system level ...
In this article, the design of a dual-band PA developed in SiGe HBT technology and its system level ...
In this article, the design of a dual-band PA developed in SiGe HBT technology and its system level ...
This paper presents an investigation of a concurrent low-cost dual-band power amplifier (PA) fabrica...
The purpose of this thesis is to analyze a transistor under multi-band operation and investigate how...
In retrospect we can see that from the last century, wireless electronic technology has been in a ra...
In this work, a single-band power amplifier (PA) with a fixed-frequency/band output matching network...
Abstract This paper presents a dual-band power amplifier (PA) using a meandered line bandstop filter...
This paper presents the design of a dual-band power amplifier (PA) featuring similar performance at ...
Empirical thesis.Bibliography: pages 213-231.1. Introduction -- 2. Background -- 3. Analysis of harm...
International audienceThis paper presents the design of a broadband power amplifier (PA) in 130 nm S...
Recent developments of millimeter-wave BiCMOS multiband amplifiers including 0.18-µm SiGe BiCMOS con...
This thesis discusses the design, fabrication, and testing of a high efficiency, dual band radio fre...
The performances of WR-3.4 monolithic amplifiers fabricated using dual-finger 6 µm InP HBT devices a...
In this article, the design of a dual-band PA developed in SiGe HBT technology and its system level ...
In this article, the design of a dual-band PA developed in SiGe HBT technology and its system level ...
In this article, the design of a dual-band PA developed in SiGe HBT technology and its system level ...
In this article, the design of a dual-band PA developed in SiGe HBT technology and its system level ...
This paper presents an investigation of a concurrent low-cost dual-band power amplifier (PA) fabrica...
The purpose of this thesis is to analyze a transistor under multi-band operation and investigate how...
In retrospect we can see that from the last century, wireless electronic technology has been in a ra...
In this work, a single-band power amplifier (PA) with a fixed-frequency/band output matching network...
Abstract This paper presents a dual-band power amplifier (PA) using a meandered line bandstop filter...
This paper presents the design of a dual-band power amplifier (PA) featuring similar performance at ...
Empirical thesis.Bibliography: pages 213-231.1. Introduction -- 2. Background -- 3. Analysis of harm...
International audienceThis paper presents the design of a broadband power amplifier (PA) in 130 nm S...
Recent developments of millimeter-wave BiCMOS multiband amplifiers including 0.18-µm SiGe BiCMOS con...
This thesis discusses the design, fabrication, and testing of a high efficiency, dual band radio fre...
The performances of WR-3.4 monolithic amplifiers fabricated using dual-finger 6 µm InP HBT devices a...