The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires
Physical design plays an important role in connecting front-end design and back-end design in chip d...
Floorplanning plays an important role in the physical design of very large scale integration (VLSI) ...
Physical design plays an important role in connecting front-end design and back-end design in chip d...
The size of future high-performance SoC is such that the time-of-flight of wires connecting distant ...
Wire pipelining has been proposed as a viable mean to break the discrepancy between decreasing gate ...
As the size and complexity of VLSI circuits increase, the need for faster floorplanning algorithms a...
Wire Pipelining (WP) has been proposed in order to limit the impact of increasing wire delays. In ge...
Journal ArticleThe placement of microarchitectural blocks on a die can significantly impact operati...
As process technology migrates to deep submicron with feature size less than 100nm, global wire dela...
Abstract—At the integration scale of system-on-chips (SOCs), the conflicts between communication and...
Latency-insensitive design copes with excessive delays typical of global wires in current and future...
This paper presents an interconnect-driven floorplanning (IDFP) flow and algorithm integrated with m...
For the congestion issue, we found that the existing congestion models will very often over-estimate...
This paper addresses the problem of interconnect pipelining from both power consumption and bit erro...
[[abstract]]In deep submicron (DSM) era, the communication between different components is increasin...
Physical design plays an important role in connecting front-end design and back-end design in chip d...
Floorplanning plays an important role in the physical design of very large scale integration (VLSI) ...
Physical design plays an important role in connecting front-end design and back-end design in chip d...
The size of future high-performance SoC is such that the time-of-flight of wires connecting distant ...
Wire pipelining has been proposed as a viable mean to break the discrepancy between decreasing gate ...
As the size and complexity of VLSI circuits increase, the need for faster floorplanning algorithms a...
Wire Pipelining (WP) has been proposed in order to limit the impact of increasing wire delays. In ge...
Journal ArticleThe placement of microarchitectural blocks on a die can significantly impact operati...
As process technology migrates to deep submicron with feature size less than 100nm, global wire dela...
Abstract—At the integration scale of system-on-chips (SOCs), the conflicts between communication and...
Latency-insensitive design copes with excessive delays typical of global wires in current and future...
This paper presents an interconnect-driven floorplanning (IDFP) flow and algorithm integrated with m...
For the congestion issue, we found that the existing congestion models will very often over-estimate...
This paper addresses the problem of interconnect pipelining from both power consumption and bit erro...
[[abstract]]In deep submicron (DSM) era, the communication between different components is increasin...
Physical design plays an important role in connecting front-end design and back-end design in chip d...
Floorplanning plays an important role in the physical design of very large scale integration (VLSI) ...
Physical design plays an important role in connecting front-end design and back-end design in chip d...