ELECTRICAL CONDUCTIVITY OF THE ELECTRODEPOSITED COPPER POWDER FILLED LIGNOCELLULOSIC COMPOSITES

This article deals with the synthesis and characterization of electroconductive composite materials prepared by the compression molding of mixtures of lignocellulose and electrochemically deposited copper powder under different pressures, as well as with the investigation of the influence of particle morphology on conductivity and the percolation threshold of obtained composites. Electrodeposited copper powder content varied from 1.9-29.4 vol%. The analysis of the most significant properties of prepared composites and its components included impedance spectroscopy (IS) behavior, the measurements of electrical conductivity, scanning electron microscopy (SEM) and structural analysis. It has been shown that the percolation threshold (PT) depends on both particle shape and the type of spatial distribution. IS measurements and SEM analysis have shown that particles that have pronounced grain boundaries have a bit effect on the appearance of electric conductive pathways thus on the composite conductivity. The packaging effect and more pronounced interparticle contact with copper powder particles lead to the “movement” of PT, which, for the particles <45 μm and the highest processing pressure of 27 MPa, was 7.2% (v/v).This article deals with the synthesis and characterization of electroconductive composite materials prepared by the compression molding of mixtures of lignocellulose and electrochemically deposited copper powder under different pressures, as well as with the investigation of the influence of particle morphology on conductivity and the percolation threshold of obtained composites. Electrodeposited copper powder content varied from 1.9-29.4 vol%. The analysis of the most significant properties of prepared composites and its components included impedance spectroscopy (IS) behavior, the measurements of electrical conductivity, scanning electron microscopy (SEM) and structural analysis. It has been shown that the percolation threshold (PT) depends on both particle shape and the type of spatial distribution. IS measurements and SEM analysis have shown that particles that have pronounced grain boundaries have a bit effect on the appearance of electric conductive pathways thus on the composite conductivity. The packaging effect and more pronounced interparticle contact with copper powder particles lead to the “movement” of PT, which, for the particles