Design and analysis of wafer-level vacuum-encapsulated disk resonator gyroscope using a commercial MEMS process

In this Thesis, the design and analysis of a mode-matched Disk Resonator Gyroscope (DRG) characterized by high Quality factor exceeding 1 million is presented. The resonator is designed using Micro Electro Mechanical Systems (MEMS) Integrated Design for Inertial Sensors (MIDIS) process offered by Teledyne DALSA Semiconductor Incorporated (TDSI). The MIDIS process offers wafer-level vacuum encapsulation at 10 mTorr and includes Through Silicon Vias (TSVs) that allows flip chip bonding with an integrated circuit for signal detection and processing. Wafer-level encapsulation with ultra-low leak rate is achieved by using MIDIS process, with leak rate as low as 6.58E-18 atm.cm3/s. The DRG design has a circular shape of 600 æm diameter with a single crystal silicon device layer thickness of 40 æm. The designed DRG has a resonant frequency of 277.54 kHz in drive mode and 278.30 kHz in sense mode. The frequency split between drive and sense modes is 760 Hz. A Quality factor of 1.34 million is achieved for the designed DRG