Thermal Analysis on Planar Interface Stability in Solidification of Semitransparent Materials

Significant melt undercooling may be developed in the melt in front of the solid/liquid interface during solidification of semitransparent materials because of internal radiative heat transfer with the environment. A nonequilibrium plana interface solidification model has been developed recently to permit the melt undercooling near the interface. A thermal analysis is presented for the stability of such a planar interface. .