Structural failure of the polycrystalline material is influenced by the interaction between the crystal and their boundaries. Specifically, a ductile material such as copper exhibit the different mechanisms of failure depending on the direction of the crack propagation within the grain boundary. Such directional anisotropy is often studied based on Rice's criteria, which has the analytic solution in the grain boundary with [110] rotation of the axis. In this work, we expand the study of such intergranular directionality to a propagation within [100] grain boundary. This work introduces the inherent bias found in the intergranular fracture of [100] grain boundaries, using molecular dynamics simulations. Later, such observation is shown ...
The effect of extrinsic grain boundary dislocations (EGBDs) in nonequilibrium grain boundaries on th...
In this paper, 3D grain structure finite element models are used to simulate the anisotropic tensile...
Abstract. Cross-scaling simulations of nanoindentation of copper with an infinitely hard tool, em-pl...
An integrated computer simulation employing the Embedded-atom method (EAM), Molecular dynamics (MD),...
The influence of grain boundaries on the mechanical properties of poly-crystalline metals is well kn...
PACS. 34.20Cf { Interatomic potentials and forces. PACS. 62.20−x { Mechanical properties of solids. ...
Mechanical properties of copper have been studied using effective-medium theory and Molecular-Dynam...
We utilize molecular dynamics simulations to investigate the dynamic interaction between the grain b...
International audienceThe size and the character (low and large angle, special boundaries, tilt and ...
This paper presents research on the development of a simulation method for the study of the mechanis...
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Materials Science and Engineeri...
International audienceThe occurrence of dynamic embrittlement during tensile tests of copper alloys ...
International audienceThe investigation of the mechanical behaviour of grain boundaries (GB) at the ...
In this research parallel molecular dynamics (MD) simulations have been performed to study the defor...
The dynamic nanomechanical characteristics of Cu films with different grain boundaries under nanoind...
The effect of extrinsic grain boundary dislocations (EGBDs) in nonequilibrium grain boundaries on th...
In this paper, 3D grain structure finite element models are used to simulate the anisotropic tensile...
Abstract. Cross-scaling simulations of nanoindentation of copper with an infinitely hard tool, em-pl...
An integrated computer simulation employing the Embedded-atom method (EAM), Molecular dynamics (MD),...
The influence of grain boundaries on the mechanical properties of poly-crystalline metals is well kn...
PACS. 34.20Cf { Interatomic potentials and forces. PACS. 62.20−x { Mechanical properties of solids. ...
Mechanical properties of copper have been studied using effective-medium theory and Molecular-Dynam...
We utilize molecular dynamics simulations to investigate the dynamic interaction between the grain b...
International audienceThe size and the character (low and large angle, special boundaries, tilt and ...
This paper presents research on the development of a simulation method for the study of the mechanis...
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Materials Science and Engineeri...
International audienceThe occurrence of dynamic embrittlement during tensile tests of copper alloys ...
International audienceThe investigation of the mechanical behaviour of grain boundaries (GB) at the ...
In this research parallel molecular dynamics (MD) simulations have been performed to study the defor...
The dynamic nanomechanical characteristics of Cu films with different grain boundaries under nanoind...
The effect of extrinsic grain boundary dislocations (EGBDs) in nonequilibrium grain boundaries on th...
In this paper, 3D grain structure finite element models are used to simulate the anisotropic tensile...
Abstract. Cross-scaling simulations of nanoindentation of copper with an infinitely hard tool, em-pl...