The design and fabrication of N-channel MOS transistors with effective gate lengths of 0.5μm or smaller have been completed at the Semiconductor and Microsystems Fabrication Laboratory at the Rochester Institute of Technology. An NMOS device with Lmask = 0.7μm results in an Leff= 0.5μm. The drive current for this device with supply voltage of 3.5V is 108μA/μm. The sub-threshold slope is 100mV/decade and a DIBL parameter of 29mV/V is reported. An NMOS device withLmask=0.6μm results in an Leff =0.4μm. The drive current for this device with supply voltage of 3.5V is l40μA/μm. The sub-threshold slope is 103mV/decade and a DIBL parameter of 11OmV/V is reported. These are RIT’s first sub-0.5micron MOS transistors
Conductive tin oxide films were deposited through reactive sputtering on glass substrates under diff...
The work function of p-type and n-type metal electrode materials deposited by RF magnetron sputterin...
This project entailed the design, fabrication, and testing of a surface micro-machined electret pres...
A dry etch S1O2 process was optimized using the Plasmatrac 2406 RIE etcher at RIT, while maintaining...
As device scaling is an ever present concern in semiconductor manufacturing, the need for thin, conf...
The objective of this project is to fabricate linear metallic patterns based on block copolymer lith...
Thermally actuated micromirrors were fabricated to demonstrate a CMOS compatible surface micromachin...
A study has been performed to investigate oxynitrides as thin gate dielectrics. The method of nitrid...
The objective of this project was to investigate the possibility of producing array of microplasma, ...
The fabrication of T-gate structures using a bilayer resist scheme of PMMA 495K molecular weight (4%...
A 126 bit by one bit NMDS static RAM was designed following design rules for RIT’s standard four lay...
As device sizes reduce in size and processes become more complex, enhancement techniques for optical...
Crystalline silicon source/drain FInFET structures were designed, fabricated, and tested at the RIT ...
Resonant Interband Tunnel Diodes (RITD) with device sizes ranging from r=20μm to r=50nm (mask define...
As transistors have decreased in size and increased in packing density, a need has arisen for an alt...
Conductive tin oxide films were deposited through reactive sputtering on glass substrates under diff...
The work function of p-type and n-type metal electrode materials deposited by RF magnetron sputterin...
This project entailed the design, fabrication, and testing of a surface micro-machined electret pres...
A dry etch S1O2 process was optimized using the Plasmatrac 2406 RIE etcher at RIT, while maintaining...
As device scaling is an ever present concern in semiconductor manufacturing, the need for thin, conf...
The objective of this project is to fabricate linear metallic patterns based on block copolymer lith...
Thermally actuated micromirrors were fabricated to demonstrate a CMOS compatible surface micromachin...
A study has been performed to investigate oxynitrides as thin gate dielectrics. The method of nitrid...
The objective of this project was to investigate the possibility of producing array of microplasma, ...
The fabrication of T-gate structures using a bilayer resist scheme of PMMA 495K molecular weight (4%...
A 126 bit by one bit NMDS static RAM was designed following design rules for RIT’s standard four lay...
As device sizes reduce in size and processes become more complex, enhancement techniques for optical...
Crystalline silicon source/drain FInFET structures were designed, fabricated, and tested at the RIT ...
Resonant Interband Tunnel Diodes (RITD) with device sizes ranging from r=20μm to r=50nm (mask define...
As transistors have decreased in size and increased in packing density, a need has arisen for an alt...
Conductive tin oxide films were deposited through reactive sputtering on glass substrates under diff...
The work function of p-type and n-type metal electrode materials deposited by RF magnetron sputterin...
This project entailed the design, fabrication, and testing of a surface micro-machined electret pres...