A test system was installed at JUT that can automatically test every die on a wafer without any operator interruption. The system integrates a Rucker & Kolls 681A wafer probe station, an HP4145 parameter analyzer, an HP Apollo work station, and a Keithley switch matrix. IC-CAP software was used for system control and data extraction. The system was designed to be flexible so additional tests can he added. Any process and any test that an HP4145 can complete manually can be tested using the automated system. Only a few variables regarding die size, device location, data extraction methods, and HP4145 test parameters, need to be changed. For demonstration of the system, the RIT PMOS process was used, and threshold voltage was measured, extrac...
The particle size distribution of a vacuum pump oil aerosol (Inland-99) generated by an ultrasonic a...
Planar-junction, 1 mm x 1 mm, p+/n/n+ silicon solar cells, both with and without a textured surface,...
In this work, a mathematical relationship between the transfer efficiency of a high volume low press...
An IBM computer, a HP4145B parametric analyzer, a Micromanipulator 410 capacitance meter, and a Keit...
This project dealt with the design and installation of a TCA bubbler system. Considerations for safe...
An Autosort Mark II wafer flatness tester was installed and initial runs and performance testing acc...
SUPREM simulations were run to determine a junction depth of 3um and a sheet resistance of approxima...
The use of Open-Path Fourier Transform Infrared (OP-FTIR) Spectroscopy coupled with principles of co...
Modifications were made to a bench-top dustiness tester to allow for the simultaneous collection of ...
The objective of this project was to investigate the possibility of producing array of microplasma, ...
MOS Capacitors were used to determine minority carrier lifetimes by obtaining capacitance vs time da...
This project entailed the design, fabrication, and testing of a surface micro-machined electret pres...
The Tegal 700 plasma etcher was used to etch trenches into four micron deep p-type diffused resistor...
A simple method to evaluate photoresist sensitivity and development/exposure latitude was developed ...
Novel test chip structures isolating process problems in certain device regions were designed in are...
The particle size distribution of a vacuum pump oil aerosol (Inland-99) generated by an ultrasonic a...
Planar-junction, 1 mm x 1 mm, p+/n/n+ silicon solar cells, both with and without a textured surface,...
In this work, a mathematical relationship between the transfer efficiency of a high volume low press...
An IBM computer, a HP4145B parametric analyzer, a Micromanipulator 410 capacitance meter, and a Keit...
This project dealt with the design and installation of a TCA bubbler system. Considerations for safe...
An Autosort Mark II wafer flatness tester was installed and initial runs and performance testing acc...
SUPREM simulations were run to determine a junction depth of 3um and a sheet resistance of approxima...
The use of Open-Path Fourier Transform Infrared (OP-FTIR) Spectroscopy coupled with principles of co...
Modifications were made to a bench-top dustiness tester to allow for the simultaneous collection of ...
The objective of this project was to investigate the possibility of producing array of microplasma, ...
MOS Capacitors were used to determine minority carrier lifetimes by obtaining capacitance vs time da...
This project entailed the design, fabrication, and testing of a surface micro-machined electret pres...
The Tegal 700 plasma etcher was used to etch trenches into four micron deep p-type diffused resistor...
A simple method to evaluate photoresist sensitivity and development/exposure latitude was developed ...
Novel test chip structures isolating process problems in certain device regions were designed in are...
The particle size distribution of a vacuum pump oil aerosol (Inland-99) generated by an ultrasonic a...
Planar-junction, 1 mm x 1 mm, p+/n/n+ silicon solar cells, both with and without a textured surface,...
In this work, a mathematical relationship between the transfer efficiency of a high volume low press...