Add to ORKGA study was conducted in which a series ofexperiments were performed using three positive photoresists and three developers in crossed experimentation, simulating semiconductor fabrication steps. Tests conducted, examined coating uniformity, unexposed resist loss, photosensitivity, undercut, and resist flow. Although there was not a clear-cut optimum resist/developer pair, some worked better than others
Ce travail vise l’étude des résines utilisées en microélectonique. Le procédé de fabrication des cir...
A method of determining photoresist image modulation was investigated and utilized, in determining t...
A Central—Composite Full Factorial design was performed in aiming to optimize the develop and bake p...
A study was conducted in which a series ofexperiments were performed using three positive photoresis...
Experimental analysis via the Perkin Elmer Development Rate Monitor (DRM) has determined that KTI-82...
Positive resist coated wafers were Immersed in a dilute alkaline base developer, such as 5:1 AZ351, ...
Wafertrac processing was used to optimize the photolithographic process of Shipley 812 positive phot...
A mechan ism for the deve lopment of positive optical photoresists is proposed, leading to the deriv...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
An important goal of the microelectronics industry is to make new technological advances while keepi...
Undyed, AZ 1512,and dyed, AZ 1512-SFD, photoresist was coated on aluminum covered oxide topography. ...
This paper investigates Neureuther and co-workers development model of positive novolak-type photore...
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Physics, 2008.Includes bibliographica...
A static coating program and a spray/static development program were developed, for use on the Wafer...
In this study, dry film photoresist was patterned using UV lithography and the sidewall profile was ...
Ce travail vise l’étude des résines utilisées en microélectonique. Le procédé de fabrication des cir...
A method of determining photoresist image modulation was investigated and utilized, in determining t...
A Central—Composite Full Factorial design was performed in aiming to optimize the develop and bake p...
A study was conducted in which a series ofexperiments were performed using three positive photoresis...
Experimental analysis via the Perkin Elmer Development Rate Monitor (DRM) has determined that KTI-82...
Positive resist coated wafers were Immersed in a dilute alkaline base developer, such as 5:1 AZ351, ...
Wafertrac processing was used to optimize the photolithographic process of Shipley 812 positive phot...
A mechan ism for the deve lopment of positive optical photoresists is proposed, leading to the deriv...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
An important goal of the microelectronics industry is to make new technological advances while keepi...
Undyed, AZ 1512,and dyed, AZ 1512-SFD, photoresist was coated on aluminum covered oxide topography. ...
This paper investigates Neureuther and co-workers development model of positive novolak-type photore...
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Physics, 2008.Includes bibliographica...
A static coating program and a spray/static development program were developed, for use on the Wafer...
In this study, dry film photoresist was patterned using UV lithography and the sidewall profile was ...
Ce travail vise l’étude des résines utilisées en microélectonique. Le procédé de fabrication des cir...
A method of determining photoresist image modulation was investigated and utilized, in determining t...
A Central—Composite Full Factorial design was performed in aiming to optimize the develop and bake p...