Thermal cycling as well as spatial and thermal gradient affects the lifetime reliability and performance of heterogeneous multiprocessor systems-on-chips (MPSoCs). Conventional temperature management techniques are not intelligent enough to cater for performance, energy efficiency as well as operating temperature of the system. In this paper we propose a light-weight novel thermal management mechanism (P-EdgeCoolingMode) in the form of intelligent software agent, which monitors and regulates the operating temperature of the CPU cores to improve reliability of the system while catering for performance requirements. P-EdgeCoolingMode is capable of pro-actively monitoring performance and based on the user’s demand the agent takes necessary act...
3D stacked systems reduce communication delay in multiprocessor system-on-chips (MPSoCs) and enable ...
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thu...
Recently, processor power density has been increasing at an alarming rate result- ing in high on-chi...
Thermal cycling as well as temperature gradient in time and space affects the lifetime reliability a...
High operating temperature and frequent thermal cycles in a multi-processor system-on-chip, which is...
Heterogeneous Multiprocessor System-on-Chip (MPSoC) are progressively becoming predominant in most m...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
In deep submicron era, thermal hot spots and large temperature gradients significantly impact system...
Editor's note: Thermal management in high-performance multicore platforms has become exceedingly com...
ABSTRACT- Heterogeneous multiprocessor system-on-chips (MPSoCs) which consist of cores with various ...
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thu...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
Technology scaling imposes an ever increasing temperature stress on digital circuit design due to tr...
3D stacked systems reduce communication delay in multiprocessor system-on-chips (MPSoCs) and enable ...
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thu...
Recently, processor power density has been increasing at an alarming rate result- ing in high on-chi...
Thermal cycling as well as temperature gradient in time and space affects the lifetime reliability a...
High operating temperature and frequent thermal cycles in a multi-processor system-on-chip, which is...
Heterogeneous Multiprocessor System-on-Chip (MPSoC) are progressively becoming predominant in most m...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
In deep submicron era, thermal hot spots and large temperature gradients significantly impact system...
Editor's note: Thermal management in high-performance multicore platforms has become exceedingly com...
ABSTRACT- Heterogeneous multiprocessor system-on-chips (MPSoCs) which consist of cores with various ...
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thu...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
Technology scaling imposes an ever increasing temperature stress on digital circuit design due to tr...
3D stacked systems reduce communication delay in multiprocessor system-on-chips (MPSoCs) and enable ...
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thu...
Recently, processor power density has been increasing at an alarming rate result- ing in high on-chi...