Thermal Properties of Epoxy Composites Reinforced with Hollow Glass Microsphere Particulates

Composite materials are emerging as a potential material which are now being used in various applications which includes aircraft, helicopters, space-craft, satellites, ships, submarines, microelectronics, building purpose etc. This composite material has grown deep interest of many researchers all around the world. Among the various class of available composite material, polymeric composites have emerged as important materials because of their light weight, high specific strength and stiffness, excellent fatigue resistance and outstanding corrosion resistance compared to most common metallic alloys. In that respect, the present work aims at developing a class of polymer composites consisting of epoxy as a matrix material with hollow glass microsphere as a reinforcing material. A set of composites with varying loading of filler content ranging up to 25 wt. % has been fabricated using simple hand lay-up technique. The effect of filler content on thermal properties of such fabricated samples is investigated. The various thermal property evaluated are thermal conductivity, glass transition temperature and coefficient of thermal expansion. From the experimental results, it is found that hollow glass micro-sphere filled epoxy composites exhibit improved thermal insulation property, increased glass transition temperature and reduced coefficient of thermal expansion. With modified thermal property, the presently fabricated composites have the potential to be used in applications where thermal insulation is of prime importance. Also with improved glass transition temperature and coefficient of thermal expansion material can find its application where resistance to thermal fatigue is require