We introduce a novel method of optically inducing microsized subsurface structures using non-linear absorption of near infrared light in mono-crystalline silicon. We discuss the physical processes such as multi-photon absorption and self focussing in the material. The results presented in this paper demonstrate a new method of subsurface modifications in silicon and may open up novel avenues for optical devices embedded in silicon and optical process for the separation of wafers from their ingots
Cataloged from PDF version of thesis.Includes bibliographical references (leaves 44-48).Thesis (Mast...
Wafer dicing is the technology to separate wafers into divided components known as dies. New develop...
Thesis (Ph. D.)--University of Rochester. Dept. of Electrical and Computer Engineering, 2009.This th...
We introduce a novel method of optically inducing microsized subsurface structures using non-linear ...
We have recently reported a direct laser writing method enabling buried structures deep inside silic...
Material modification inside its bulk via high powered lasers involves much more than just heat tran...
Using focused subnanosecond laser pulses at 1.064μm wavelength, modification of silicon into opaque ...
Laser-induced subsurface modification of dielectric materials is a well-known technology. Applicatio...
Nonlinear optical phenomena in silicon such as self-focusing and multi-photon absorption are strongl...
Silicon is an excellent material for microelectronics and integrated photonics 1-3, with untapped po...
In the last two decades, there has been growing interest in silicon-based photonic devices for many ...
Material modification inside its bulk via high powered lasers involves much more than just heat tran...
The wavelength dependence of the nonlinear absorption and the third order nonlinear refraction of cr...
International audienceFemtosecond lasers allow one to functionalize surfaces at a micro and nanomete...
International audienceUltrashort laser-induced modification of silicon is a process of great interes...
Cataloged from PDF version of thesis.Includes bibliographical references (leaves 44-48).Thesis (Mast...
Wafer dicing is the technology to separate wafers into divided components known as dies. New develop...
Thesis (Ph. D.)--University of Rochester. Dept. of Electrical and Computer Engineering, 2009.This th...
We introduce a novel method of optically inducing microsized subsurface structures using non-linear ...
We have recently reported a direct laser writing method enabling buried structures deep inside silic...
Material modification inside its bulk via high powered lasers involves much more than just heat tran...
Using focused subnanosecond laser pulses at 1.064μm wavelength, modification of silicon into opaque ...
Laser-induced subsurface modification of dielectric materials is a well-known technology. Applicatio...
Nonlinear optical phenomena in silicon such as self-focusing and multi-photon absorption are strongl...
Silicon is an excellent material for microelectronics and integrated photonics 1-3, with untapped po...
In the last two decades, there has been growing interest in silicon-based photonic devices for many ...
Material modification inside its bulk via high powered lasers involves much more than just heat tran...
The wavelength dependence of the nonlinear absorption and the third order nonlinear refraction of cr...
International audienceFemtosecond lasers allow one to functionalize surfaces at a micro and nanomete...
International audienceUltrashort laser-induced modification of silicon is a process of great interes...
Cataloged from PDF version of thesis.Includes bibliographical references (leaves 44-48).Thesis (Mast...
Wafer dicing is the technology to separate wafers into divided components known as dies. New develop...
Thesis (Ph. D.)--University of Rochester. Dept. of Electrical and Computer Engineering, 2009.This th...