Add to ORKGThis paper focuses on differential signal transmission above ground planes with gaps, taking into account the dielectric and conductive losses of the substrate. An equivalent lumped-circuit is proposed and its suitability is investigated by comparing the obtained numerical results with the measured data. Furthermore the differential to common mode conversion of the waves, while crossing the gap, is theoretically analyzed and experimentally verified
Dielectric properties and losses are increasingly more important in signal link path characterizatio...
Signal layer transitions in differential lines are modeled using both FDTD and equivalent circuit me...
A 26-layer printed circuit board including several test sites has been analyzed. All the sites have ...
This paper focuses on differential signal transmission above ground planes with gaps, taking into a...
The finite-difference time-domain method is applied to the analysis of transmission lines on printed...
The finite-difference time-domain method is applied to the analysis of transmission lines on printed...
The finite-difference time-domain method is applied to the analysis of transmission lines on printed...
Differential and common-mode transfer impedances are proposed herein to analyze noise coupled to (fr...
Copper foil in printed circuit board (PCB) transmission lines/interconnects is roughened to promote ...
Signal integrity and crosstalk are issues of paramount importance in the design of high speed printe...
Due to the increase in board density, routing traces on different layers becomes a widely used strat...
Vias in differential transmission lines have been modeled using the finite-difference time-domain (F...
With increasing board complexity and operating frequencies, signal integrity (SI) and radiated emiss...
With increasing board complexity and operating frequencies, signal integrity (SI) and radiated emiss...
The main focus of this thesis is placed on high frequency PCB signal Integrity Is-sues and RF/Microw...
Dielectric properties and losses are increasingly more important in signal link path characterizatio...
Signal layer transitions in differential lines are modeled using both FDTD and equivalent circuit me...
A 26-layer printed circuit board including several test sites has been analyzed. All the sites have ...
This paper focuses on differential signal transmission above ground planes with gaps, taking into a...
The finite-difference time-domain method is applied to the analysis of transmission lines on printed...
The finite-difference time-domain method is applied to the analysis of transmission lines on printed...
The finite-difference time-domain method is applied to the analysis of transmission lines on printed...
Differential and common-mode transfer impedances are proposed herein to analyze noise coupled to (fr...
Copper foil in printed circuit board (PCB) transmission lines/interconnects is roughened to promote ...
Signal integrity and crosstalk are issues of paramount importance in the design of high speed printe...
Due to the increase in board density, routing traces on different layers becomes a widely used strat...
Vias in differential transmission lines have been modeled using the finite-difference time-domain (F...
With increasing board complexity and operating frequencies, signal integrity (SI) and radiated emiss...
With increasing board complexity and operating frequencies, signal integrity (SI) and radiated emiss...
The main focus of this thesis is placed on high frequency PCB signal Integrity Is-sues and RF/Microw...
Dielectric properties and losses are increasingly more important in signal link path characterizatio...
Signal layer transitions in differential lines are modeled using both FDTD and equivalent circuit me...
A 26-layer printed circuit board including several test sites has been analyzed. All the sites have ...