Via transition modeling and charge replenishment of the power delivery network in multilayer PCBs

In the first article of this thesis, the charge delivery in the power distribution network for printed circuit board has been analyzed in the time-domain. Performing all the simulations and analyzing the PDN physics and modeling, I contributed to a better understanding of the time-domain decoupling mechanism. The second paper studies the noise coupling sing a segmentation approach combined with a via-to-antipad capacitance model and a plane-pair cavity model. Building equivalent circuit models as well as analyzing design strategies, I contributed to a new approach for the PDN analysis in multilayer PCBs. The third article discusses how to estimate the amount of current needed for large ICs and how to evaluate the amount of noise voltage due to this current draw. After accurate discussion of the design strategies, I modeled and simulated the free evolution of a charged PCB with and without decoupling capacitors. The depletion of charges stored between the power buses in time and frequency-domain has been investigated as a function of the plane thickness, SMT decoupling closeness in the fourth paper. With my contribution, the time and frequency-domain in the PDN have been related using circuit approach. In the fifth paper, I analyzed a 26-layer printed circuit board performing milling, measurements and building circuit models. It is the first time that the segmentation approach has been used for differential geometry. In addition, Debye materials have been implemented in the cavity model --Abstract, page iv