High-speed digital systems are moving to higher data rates and smaller supply voltages as the scale of integration goes smaller. With the smaller bit periods and the smaller operating voltages, the tolerable timing and noise margins are reducing. There are many sources of disturbances contributing to the tolerance margins. These margins have to account for inter symbol interference (ISI), reflections, jitter, noise from power distribution networks (PDN) and crosstalk. An important task during the design phase of the system is to find and mitigate the noise from such sources. This thesis proposes modeling and analysis methodology to resolve some of the problems while proposing relevant design methodologies to reduce the system design cycles....
As the semiconductor process nodes advance to 28nm and below and three-dimensional (3D) silicon inte...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
In high performance integrated circuits phenomena like crosstalk, IR drops, electromigration and gro...
Power noise is one of the key signal integrity problems. Unlike the design of signal paths, where th...
Power noise is one of the key signal integrity problems. Unlike the design of signal paths, where th...
This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besi...
In today’s demand for faster data rates and more features to be integrated on single printed circuit...
In Section 1, the focus is on alleviating the modeling challenges by breaking the overall geometry i...
When the performances of the electronic technology increase (higher frequencies, more power, lover p...
The pursuit for higher performance at a lower cost is driving rapid progress in the field of package...
The pursuit for higher performance at a lower cost is driving rapid progress in the field of package...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
118 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2004.We propose a novel approach t...
As the semiconductor process nodes advance to 28nm and below and three-dimensional (3D) silicon inte...
As layout density increases in highly integrated multilayer printed circuit boards (PCBs), the noise...
As the semiconductor process nodes advance to 28nm and below and three-dimensional (3D) silicon inte...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
In high performance integrated circuits phenomena like crosstalk, IR drops, electromigration and gro...
Power noise is one of the key signal integrity problems. Unlike the design of signal paths, where th...
Power noise is one of the key signal integrity problems. Unlike the design of signal paths, where th...
This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besi...
In today’s demand for faster data rates and more features to be integrated on single printed circuit...
In Section 1, the focus is on alleviating the modeling challenges by breaking the overall geometry i...
When the performances of the electronic technology increase (higher frequencies, more power, lover p...
The pursuit for higher performance at a lower cost is driving rapid progress in the field of package...
The pursuit for higher performance at a lower cost is driving rapid progress in the field of package...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
118 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2004.We propose a novel approach t...
As the semiconductor process nodes advance to 28nm and below and three-dimensional (3D) silicon inte...
As layout density increases in highly integrated multilayer printed circuit boards (PCBs), the noise...
As the semiconductor process nodes advance to 28nm and below and three-dimensional (3D) silicon inte...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
In high performance integrated circuits phenomena like crosstalk, IR drops, electromigration and gro...