Non-metallic substrates, such as plastics or oxides, need to be activated before electroless metal deposition. In this paper, a novel process of using metal Pd and Pd-Cu ion loaded organic solutions for surface activation of non-metallic substrates is described. The organic media used are strong polarizing and low ionic conducting solutions of the type commonly used in the solvent extraction industry. Different types of non-metallic substrates, including polyester, alumina and carbon nanotubes, have been evaluated, and it was shown that a uniform and complete Cu coating can be electrolessly deposited after activation in metal ion loaded organic solutions
Electroless plating is a metal deposition technique widely used in the coating industry. It is the m...
International audienceThe ligand induced electroless plating (LIEP) process was recently developed a...
A reliable and low-cost method to synthesize high-adhesion and low-resistivity copper patterns on fl...
A novel process for immersion metal seed layer deposition on electronic material substrates from org...
The ability to modify the activity of polymer substrates for subsequent electroless plating is of fu...
Electrochemical deposition (ECD) has been used widely in the electronics industry. A novel galvanic...
Electroless plating of metal films on polymer substrates usually requires the presence of metal part...
International audienceA new efficient approach for selective metallization of flexible substrates su...
Uniform and high density copper seed crystals were deposited on TaSiN barrier layers using a novel p...
Electroless metallization of polymers requires dierent steps including (i) the preconditioning of th...
This thesis investigates adhesion at two interfaces of interest in the photoselective metal depositi...
In this study, copper-coated multi-walled carbon nanotubes (MWCNTs) were prepared using electroless ...
In our study, we examined the formation of thin films of silver nanoparticles on polycarbonate and t...
In this work, carbon nanotubes were activated with Pd-Sn catalytic nuclei via a single-step activati...
International audienceThe paper reports the use of self-assembled monolayers (SAMs) of dithiols to i...
Electroless plating is a metal deposition technique widely used in the coating industry. It is the m...
International audienceThe ligand induced electroless plating (LIEP) process was recently developed a...
A reliable and low-cost method to synthesize high-adhesion and low-resistivity copper patterns on fl...
A novel process for immersion metal seed layer deposition on electronic material substrates from org...
The ability to modify the activity of polymer substrates for subsequent electroless plating is of fu...
Electrochemical deposition (ECD) has been used widely in the electronics industry. A novel galvanic...
Electroless plating of metal films on polymer substrates usually requires the presence of metal part...
International audienceA new efficient approach for selective metallization of flexible substrates su...
Uniform and high density copper seed crystals were deposited on TaSiN barrier layers using a novel p...
Electroless metallization of polymers requires dierent steps including (i) the preconditioning of th...
This thesis investigates adhesion at two interfaces of interest in the photoselective metal depositi...
In this study, copper-coated multi-walled carbon nanotubes (MWCNTs) were prepared using electroless ...
In our study, we examined the formation of thin films of silver nanoparticles on polycarbonate and t...
In this work, carbon nanotubes were activated with Pd-Sn catalytic nuclei via a single-step activati...
International audienceThe paper reports the use of self-assembled monolayers (SAMs) of dithiols to i...
Electroless plating is a metal deposition technique widely used in the coating industry. It is the m...
International audienceThe ligand induced electroless plating (LIEP) process was recently developed a...
A reliable and low-cost method to synthesize high-adhesion and low-resistivity copper patterns on fl...