The analysis presented herein contains closed-form analytical expressions to calculate attenuation in a layered structure rough metal-dielectric-dielectric , which is a practically important problem in separating dielectric loss from rough conductor loss in actual PCB stripline geometries, when measuring dielectric constant (Dk) and dissipation factor (Df) using travelling wave S-parameter methods. This approach is based on the surface impedance concept. It is shown that the presence of an epoxy layer on the conductor may affect extracted dielectric parameters, of a PCB substrate, especially the Df data
A model to substitute conductor surface roughness in printed circuit boards by a layer with an effec...
Conductor (copper) foil surface roughness in printed circuit boards (PCBs) is inevitable due to adhe...
Signal integrity (SI) and power integrity (PI) modelling and design require accurate knowledge of di...
Abstract — Knowledge on dielectric constant and loss tangent of printed circuit boards (PCB) in a wi...
Requirement of high-speed data transmission has led to a rising interest in the gigahertz region and...
Dielectric substrate and foil surface roughness properties of fabricated printed circuit boards (PCB...
Analysis of printed circuit board (PCB) behavior in a wide frequency range from tens MHz to at least...
The paper is devoted to a methodology and an improved technique of characterization of low-loss diel...
Copper foil in printed circuit board (PCB) transmission lines/interconnects is roughened to promote ...
A new improved traveling-wave technique to characterize material properties of printed circuit board...
Recently, an experiment-based traveling-wave technique to separate conductor loss from dielectric lo...
High-speed digital design and signal integrity (SI) engineers need accurate characterization of comm...
Conductor loss due to the roughened metal foil surface has significant effects on high-speed signals...
Conductors with a roughened surface have significant effects on high-speed signal propagation on bac...
The experiment-based differential and extrapolation techniques to extract frequency-dependent dielec...
A model to substitute conductor surface roughness in printed circuit boards by a layer with an effec...
Conductor (copper) foil surface roughness in printed circuit boards (PCBs) is inevitable due to adhe...
Signal integrity (SI) and power integrity (PI) modelling and design require accurate knowledge of di...
Abstract — Knowledge on dielectric constant and loss tangent of printed circuit boards (PCB) in a wi...
Requirement of high-speed data transmission has led to a rising interest in the gigahertz region and...
Dielectric substrate and foil surface roughness properties of fabricated printed circuit boards (PCB...
Analysis of printed circuit board (PCB) behavior in a wide frequency range from tens MHz to at least...
The paper is devoted to a methodology and an improved technique of characterization of low-loss diel...
Copper foil in printed circuit board (PCB) transmission lines/interconnects is roughened to promote ...
A new improved traveling-wave technique to characterize material properties of printed circuit board...
Recently, an experiment-based traveling-wave technique to separate conductor loss from dielectric lo...
High-speed digital design and signal integrity (SI) engineers need accurate characterization of comm...
Conductor loss due to the roughened metal foil surface has significant effects on high-speed signals...
Conductors with a roughened surface have significant effects on high-speed signal propagation on bac...
The experiment-based differential and extrapolation techniques to extract frequency-dependent dielec...
A model to substitute conductor surface roughness in printed circuit boards by a layer with an effec...
Conductor (copper) foil surface roughness in printed circuit boards (PCBs) is inevitable due to adhe...
Signal integrity (SI) and power integrity (PI) modelling and design require accurate knowledge of di...