Publication date
August 2017
DOI Publisher
Institute of Electrical and Electronics Engineers (IEEE)Abstract
This article consists of a collection of slides from the author\u27s conference presentation. Some of the specific areas/topics discussed include: PI module; PDN problem; geometry and inductance decomposition; PCB PDN design; circuit model behavior; logic transitions; voltage switching-dynamic current draw distrubances; conduction current path; power plane and capacitor location matrix; power plane location in layer stack; capacitor location; SMT decoupling; SMT capacitors; PCB PDN circuit model; voltage ripple separation; and package design flow
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