Causes of breakdown, both mechanical and electrical, in high voltage, high energy density, BaTiO₃ multilayer ceramic capacitors were studied. The flexural strength of the capacitors was 96 +/- 13 MPa. Failure was due to surface defects or pores close to the surfaces of the samples. The dielectric breakdown strength of the samples was 181 kV/cm. The causes of breakdown were either field enhancements due to electrode end effects or pores between the dielectric and electrode layers...The one common source of failure was porosity although it was located in different regions of the capacitors. Liquid-phase sintering can be used to eliminate porosity and therefore was chosen to improve the electrical and mechanical strengths of the capacitors --A...
The opportunities are introduced to calculate the electrical, mechanical, and thermal couplings of c...
A combination of two-dimensional (2D) and three-dimensional (3D) finite element (FE) models of large...
Surface mounted components are being used increasingly in electronics, but the manufacture and assem...
Causes of breakdown, both mechanical and electrical, in high voltage, high energy density, BaTiO3 ca...
Local elastic and thermal behaviors of dielectric breakdown regions in BaTiO3 based multilayer ceram...
An investigation was conducted into failure of a multilayer ceramic capacitor (MLCC) mounted on a pr...
The effect of porosity on the electrical properties of BaTiO3-based MultilayerCeramic Capacitors (ML...
Multilayer ceramic capacitors (MLCC) are essential components for determining the reliability of ele...
Local electric-field around multitype pores (dielectric pore, interface pore, electrode pore) in mul...
The authors have empirically determined the dependence of breakdown field EB versus dielectric thick...
AbstractThis paper discusses the reliability of the high energy storage density ceramic capacitor fu...
An review with 61 refs. is given of the fracture of and stress situation in ceramic capacitor materi...
In an effort to develop transmission lines with higher energy storage capabilities for compact pulse...
Class II Multilayer Ceramic Capacitors (MLCCs) are one of the most widely adopted types of passive c...
Electrical conductivity at high electric fields and dielectric breakdown of bulk ceramic insulators ...
The opportunities are introduced to calculate the electrical, mechanical, and thermal couplings of c...
A combination of two-dimensional (2D) and three-dimensional (3D) finite element (FE) models of large...
Surface mounted components are being used increasingly in electronics, but the manufacture and assem...
Causes of breakdown, both mechanical and electrical, in high voltage, high energy density, BaTiO3 ca...
Local elastic and thermal behaviors of dielectric breakdown regions in BaTiO3 based multilayer ceram...
An investigation was conducted into failure of a multilayer ceramic capacitor (MLCC) mounted on a pr...
The effect of porosity on the electrical properties of BaTiO3-based MultilayerCeramic Capacitors (ML...
Multilayer ceramic capacitors (MLCC) are essential components for determining the reliability of ele...
Local electric-field around multitype pores (dielectric pore, interface pore, electrode pore) in mul...
The authors have empirically determined the dependence of breakdown field EB versus dielectric thick...
AbstractThis paper discusses the reliability of the high energy storage density ceramic capacitor fu...
An review with 61 refs. is given of the fracture of and stress situation in ceramic capacitor materi...
In an effort to develop transmission lines with higher energy storage capabilities for compact pulse...
Class II Multilayer Ceramic Capacitors (MLCCs) are one of the most widely adopted types of passive c...
Electrical conductivity at high electric fields and dielectric breakdown of bulk ceramic insulators ...
The opportunities are introduced to calculate the electrical, mechanical, and thermal couplings of c...
A combination of two-dimensional (2D) and three-dimensional (3D) finite element (FE) models of large...
Surface mounted components are being used increasingly in electronics, but the manufacture and assem...