This article describes an extraction technique of input and output impedances of integrated circuits (ICs) implemented onto the printed circuit boards (PCBs). The feasibility of the technique is illustrated with a proof-of-concept (POC) constituted by two ICs operating in a typically transmitter-receiver (Tx-Rx) circuit. The POC system is assumed composed of three different blocks of emitter signal source, load and interconnect passive network. This latter one is assumed defined by its chain matrix known from its electrical and physical characteristics. The proposed impedance extraction method is elaborated from the given signals at the transmitter output and receiver input. The terminal access impedances are formulated in function of the p...
Via interconnects in multilayer substrates, such as chip scale packaging, ball grid arrays, multichi...
Electromagnetic interference (EMI) coupling associated with inter-board connection is investigated. ...
In this paper we extract the characteristic impedance of Back End Of Line (BEOL) interconnections f...
A linear high-frequency lumped-element model extraction from a two-terminal measured impedance by an...
In multilayer printed circuit boards, the noise on the power bus is influenced by the impedance betw...
Parasitic inductance in printed circuit board (PCB) geometries can detrimentally impact the electrom...
The concepts of inductance and partial inductance play a key role in printed circuit board (PCB) mod...
[[abstract]]A comprehensive system and method allow an integrated circuit designer to extract accura...
When designing and building power systems that contain power electronic switching sources and loads,...
The modern era of technology contains a myriad of high-speed standards and proprietary serial digita...
Switching in power semiconductors with emerging materials such as silicon carbide (SiC) leads to und...
This paper analyzes the fundamental behavior of PCB power bus structures using the modal expansion m...
The effectiveness of dc power-bus decoupling is impacted by the inductance associated with interconn...
The in-circuit impedance of a critical electrical system provides valuable information on its operat...
In this paper I-V method-based impedance measurement of power distribution network (PDN) in printed ...
Via interconnects in multilayer substrates, such as chip scale packaging, ball grid arrays, multichi...
Electromagnetic interference (EMI) coupling associated with inter-board connection is investigated. ...
In this paper we extract the characteristic impedance of Back End Of Line (BEOL) interconnections f...
A linear high-frequency lumped-element model extraction from a two-terminal measured impedance by an...
In multilayer printed circuit boards, the noise on the power bus is influenced by the impedance betw...
Parasitic inductance in printed circuit board (PCB) geometries can detrimentally impact the electrom...
The concepts of inductance and partial inductance play a key role in printed circuit board (PCB) mod...
[[abstract]]A comprehensive system and method allow an integrated circuit designer to extract accura...
When designing and building power systems that contain power electronic switching sources and loads,...
The modern era of technology contains a myriad of high-speed standards and proprietary serial digita...
Switching in power semiconductors with emerging materials such as silicon carbide (SiC) leads to und...
This paper analyzes the fundamental behavior of PCB power bus structures using the modal expansion m...
The effectiveness of dc power-bus decoupling is impacted by the inductance associated with interconn...
The in-circuit impedance of a critical electrical system provides valuable information on its operat...
In this paper I-V method-based impedance measurement of power distribution network (PDN) in printed ...
Via interconnects in multilayer substrates, such as chip scale packaging, ball grid arrays, multichi...
Electromagnetic interference (EMI) coupling associated with inter-board connection is investigated. ...
In this paper we extract the characteristic impedance of Back End Of Line (BEOL) interconnections f...