The demand for wearable electronics has resulted in an increasing interest inthe development of functional fibers, with a specific focus upon the development of electrically conductive fibers incorporable into garments. However,the production of thermally conductive fibers for heat dissipation has beenlargely neglected. Owing to the very rapid development of miniaturized wearable electronics, there is an increasing need for the development of thermallyconductive fibers as heat sinks and thermal management processes. In thisstudy, thermally conductive but electrically insulating boron nitride nanopowder (BNNP) fillers are used to effectively enhance the thermal conductivityand mechanical properties of elastomeric polyurethane fibers. Thermal...
The continuous development of high electrical equipment towards high power output requires better he...
The development of thermal conduction polymer-based composites is important to solve the heat dissip...
With the advent of the 5G era, hexagonal boron nitride (BN) platelets are ideal fillers to incorpora...
The demand for wearable electronics has resulted in an increasing interest inthe development of func...
The demand for wearable electronics has resulted in an increasing interest in the development of fun...
The heat accumulation has become a serious problem due to electronic devices towards high power and ...
In this study, we constructed hybrid three-dimensional (3D) filler networks by simply incorporating ...
Efficient heat dissipation is a prerequisite for further improving the integration of devices. Howev...
Highly flexible biocompatible materials that are both thermally conductive and electrically insulati...
Thermal conductivity of individual polyvinylpyrrolidone (PVP) nanofibers embedding boron nitride nan...
It has been seen previously that addition of fillers to host material systems can create composites ...
Due to the growing needs of thermal management in modern electronics, high thermal conductive polyme...
Electrically insulating polymeric nanocomposites with high thermal conductivity have great potential...
Thermally conductive yet electrically insulating polymer composites are urgently required for therma...
With shrinking size of electronic devices, increasing performance and accompanying heat dissipation,...
The continuous development of high electrical equipment towards high power output requires better he...
The development of thermal conduction polymer-based composites is important to solve the heat dissip...
With the advent of the 5G era, hexagonal boron nitride (BN) platelets are ideal fillers to incorpora...
The demand for wearable electronics has resulted in an increasing interest inthe development of func...
The demand for wearable electronics has resulted in an increasing interest in the development of fun...
The heat accumulation has become a serious problem due to electronic devices towards high power and ...
In this study, we constructed hybrid three-dimensional (3D) filler networks by simply incorporating ...
Efficient heat dissipation is a prerequisite for further improving the integration of devices. Howev...
Highly flexible biocompatible materials that are both thermally conductive and electrically insulati...
Thermal conductivity of individual polyvinylpyrrolidone (PVP) nanofibers embedding boron nitride nan...
It has been seen previously that addition of fillers to host material systems can create composites ...
Due to the growing needs of thermal management in modern electronics, high thermal conductive polyme...
Electrically insulating polymeric nanocomposites with high thermal conductivity have great potential...
Thermally conductive yet electrically insulating polymer composites are urgently required for therma...
With shrinking size of electronic devices, increasing performance and accompanying heat dissipation,...
The continuous development of high electrical equipment towards high power output requires better he...
The development of thermal conduction polymer-based composites is important to solve the heat dissip...
With the advent of the 5G era, hexagonal boron nitride (BN) platelets are ideal fillers to incorpora...