International audienceThe inter-layer resistance in few layer graphene (FLG) is an unknown intrinsic property that affectsthe heat removal efficiency of FLG-based thermal devices. Here we present data that demonstratesthe layer number dependence of the resistance between FLGs, by using molecular dynamicssimulations. The resistance was found to decrease as the layer number increases. FLGs with largerthicknesses are proposed to be advantageous in heat spreading owing to their lower contactresistances. The observed properties do not depend on temperature, which is crucial for FLG basedstructures to retain a stable heat removal efficiency while working at a large temperature range.VC 2013 AIP Publishing LLC. [http://dx.doi.org/10.1063/1.4818341
The high thermal conductivity of graphene and few-layer graphene undergoes severe degradations throu...
Efficient thermal management of modern electronics requires the use of thin films with highly anisot...
Step junctions are often present in layered materials, i.e. where single-layer regions meet multilay...
International audienceThe inter-layer resistance in few layer graphene (FLG) is an unknown intrinsic...
International audienceWhile graphene and few layer graphene (FLG) are considered as having the highe...
Thermal conductivity kappa of both suspended and supported graphene has been studied by using molecu...
We studied the heat-spreading enhancement of supported few-layer graphene by inserting silane-functi...
International audienceWe report the layer-number dependence of the averaged interlayer thermal resis...
By using molecular dynamics simulations, we have studied heat flux in graphene Y junctions with leng...
As the electronic industry aggressively moves towards nanometer designs thermal issues are becoming ...
The Kapitza resistance (<i>R</i><sub>K</sub>) between few-layer graphene (FLG) and water was studied...
Thermal transport in low dimensional materials play a critical role in the functionality and reliabi...
This thesis is devoted to the calculation of thermal contact resistance in various molecular systems...
We use nonequilibrium molecular dynamics to study heat transfer across structures consisting of a fe...
We report a systematic investigation of the temperature dependence of electrical resistance behaviou...
The high thermal conductivity of graphene and few-layer graphene undergoes severe degradations throu...
Efficient thermal management of modern electronics requires the use of thin films with highly anisot...
Step junctions are often present in layered materials, i.e. where single-layer regions meet multilay...
International audienceThe inter-layer resistance in few layer graphene (FLG) is an unknown intrinsic...
International audienceWhile graphene and few layer graphene (FLG) are considered as having the highe...
Thermal conductivity kappa of both suspended and supported graphene has been studied by using molecu...
We studied the heat-spreading enhancement of supported few-layer graphene by inserting silane-functi...
International audienceWe report the layer-number dependence of the averaged interlayer thermal resis...
By using molecular dynamics simulations, we have studied heat flux in graphene Y junctions with leng...
As the electronic industry aggressively moves towards nanometer designs thermal issues are becoming ...
The Kapitza resistance (<i>R</i><sub>K</sub>) between few-layer graphene (FLG) and water was studied...
Thermal transport in low dimensional materials play a critical role in the functionality and reliabi...
This thesis is devoted to the calculation of thermal contact resistance in various molecular systems...
We use nonequilibrium molecular dynamics to study heat transfer across structures consisting of a fe...
We report a systematic investigation of the temperature dependence of electrical resistance behaviou...
The high thermal conductivity of graphene and few-layer graphene undergoes severe degradations throu...
Efficient thermal management of modern electronics requires the use of thin films with highly anisot...
Step junctions are often present in layered materials, i.e. where single-layer regions meet multilay...