Diamond/ZnO/LiNbO3 structure for packageless acoustic wave sensors
- Floer, Cécile
- Moutaouekkil, Mohammed
- Bartoli, Florian
- Mishra, Harshad
- Mcmurtry, Stefan
- Hage-Ali, Sami
- Elmazria, Omar
- Talbi, Abdelkrim
- Bou Matar, Olivier
- Dekkar, Damia
- Baudrillart, Benoit
- Benedic, Fabien
- Zhgoon, Sergei
- Aubert, Thierry
Publication date
October 2017
DOI Publisher
Institute of Electrical and Electronics Engineers (IEEE)Abstract
International audience—This paper studies the Diamond/ZnO/LiNbO3 structure, numerically and experimentally, as a candidate for a packageless sensor based on the surface acoustic wave technology. The structure is compared with an AlN/ZnO/LiNbO3 structure, in order to highlight better performances of diamond with respect to AlN. Early experimental results of nanocrystalline diamond growth on ZnO/Si are presented
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