Data accompanied with the paper 'Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm'. Figure 1 is the original C-scan SAM image of the FA10 flip chip sample. Table 1 shows the numerical values of the features
Although flip chips have received wide acceptance as an integrated circuit package, significant manu...
Visual inspection is an important task in the manufacturing processes for integrated circuit boards....
“C” scan ultrasonic scan testing has not been widely used in the inspection of materials compared to...
In this paper the performance of multi-narrow-band spectral analysis was evaluated concerning defect...
Surface mount technology has spurred a rapid decrease in the size of electronic packages, where sold...
Flip chip technology is being used increasingly as a method of interconnecting a die to a substrate....
Industrial applications often require failure analysis methods working non-destructively, enabling e...
Industrial applications often require failure analysis methods working non-destructively, enabling e...
In industrial manufacturing of microelectronic components, non-destructive failure analysis methods ...
Solder bump technology is being used increasingly as a method of interconnection of chips or package...
In this paper, the fuzzy filtering and conventional image processing are adopted for inspecting the ...
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for ...
AbstractSolder bump inspection of flip chip has gained more attention with the widely use of flip ch...
New semiconductor chip technologies and technologies for 3D integration require information’s of pac...
Ongoing trends in microelectronics aim at continuously increasing the integration rate and complexit...
Although flip chips have received wide acceptance as an integrated circuit package, significant manu...
Visual inspection is an important task in the manufacturing processes for integrated circuit boards....
“C” scan ultrasonic scan testing has not been widely used in the inspection of materials compared to...
In this paper the performance of multi-narrow-band spectral analysis was evaluated concerning defect...
Surface mount technology has spurred a rapid decrease in the size of electronic packages, where sold...
Flip chip technology is being used increasingly as a method of interconnecting a die to a substrate....
Industrial applications often require failure analysis methods working non-destructively, enabling e...
Industrial applications often require failure analysis methods working non-destructively, enabling e...
In industrial manufacturing of microelectronic components, non-destructive failure analysis methods ...
Solder bump technology is being used increasingly as a method of interconnection of chips or package...
In this paper, the fuzzy filtering and conventional image processing are adopted for inspecting the ...
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for ...
AbstractSolder bump inspection of flip chip has gained more attention with the widely use of flip ch...
New semiconductor chip technologies and technologies for 3D integration require information’s of pac...
Ongoing trends in microelectronics aim at continuously increasing the integration rate and complexit...
Although flip chips have received wide acceptance as an integrated circuit package, significant manu...
Visual inspection is an important task in the manufacturing processes for integrated circuit boards....
“C” scan ultrasonic scan testing has not been widely used in the inspection of materials compared to...
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