Arsenic codeposition during the initial phases of copper nucleation and growth on stainless steel in normal electrowinning conditions

Arsenic (As), bismuth (Bi) and antimony (Sb) are known to affect the quality of copper deposits in copper electrowinning operations. The codeposition of As was previously believed to occur only at current densities far exceeding the range of typical current densities for copper electrowinning. In this study, we investigate the copper electrodeposition on different pretreated stainless steel (SS) substrates from bleed electrolyte in galvanostatic mode at –45 mA/cm². Scanning electron microscopy (SEM) micrographs illustrate that during the initial phases of copper nucleation and growth, the current density was locally increased due to the pretreatments. It was reasoned that the codepostion of As could possibly occur in normal electrowinning conditions, but the risk can be substantially reduced by good SS substrate handling and maintenance practices