To gain further insight into the mechanisms underlying jet formation and elongation of laser sintered shaped charge liners under high strain rate deformation, Cu–Cr–Zr alloy liners fabricated by selective laser sintering process were deformed by explosive detonation. Their as-manufactured (liner) and resultant (slug) microstructure have been investigated in comparison with those of traditional machined liners employing both optical and scanning electron microscopy. The resultant slug microstructure of both machined and laser sintered liners revealed a smaller refined equiaxed grain size consistent with traditionally fabricated liners, characteristic of dynamic recrystallization. The disappearance of the (originally present) pores in the pos...
The metal injection molding (MIM) method was applied to manufacture a shaped charge liner (SCL) used...
K220 copper parts were produced by Selective Laser Melting (SLM) technology. The relative densities ...
Abstract The dynamic response and microstructure evolution of oxygen-free high-conductivity copper i...
© Cranfield University, 2019Shaped charges operate by explosively loading a (typically metallic) lin...
Laser processes such as laser-powder bed fusion, surface laser polishing, and laser engraving are un...
Additively manufacturing high performance metals by laser processing represents an exciting opportun...
Numerous challenges persist with the additive manufacturing of high γ′ containing Ni-based superallo...
To investigate the microstructure evolution and dynamic deformation behavior of a CoCrNi medium entr...
The solidification morphology analysis of fine Cu powder melted by a raster scanned energy beam fro...
316L stainless steel samples have been prepared by selective laser melting (SLM) using a pulsed lase...
Laser consolidation (LC) developed by National Research Council's Industrial Materials Institute (NR...
In the manufacture of parts by direct metal deposition it is common to inject powder into a molten p...
A Shaped Charge (SC) is an explosive device used to focus a detonation in a desired direction, and h...
Microstructural deformation mechanisms present during three different forming processes in commercia...
Laser cladding deposition (LCD) is widely used to remanufacture/repair workpieces because of its hig...
The metal injection molding (MIM) method was applied to manufacture a shaped charge liner (SCL) used...
K220 copper parts were produced by Selective Laser Melting (SLM) technology. The relative densities ...
Abstract The dynamic response and microstructure evolution of oxygen-free high-conductivity copper i...
© Cranfield University, 2019Shaped charges operate by explosively loading a (typically metallic) lin...
Laser processes such as laser-powder bed fusion, surface laser polishing, and laser engraving are un...
Additively manufacturing high performance metals by laser processing represents an exciting opportun...
Numerous challenges persist with the additive manufacturing of high γ′ containing Ni-based superallo...
To investigate the microstructure evolution and dynamic deformation behavior of a CoCrNi medium entr...
The solidification morphology analysis of fine Cu powder melted by a raster scanned energy beam fro...
316L stainless steel samples have been prepared by selective laser melting (SLM) using a pulsed lase...
Laser consolidation (LC) developed by National Research Council's Industrial Materials Institute (NR...
In the manufacture of parts by direct metal deposition it is common to inject powder into a molten p...
A Shaped Charge (SC) is an explosive device used to focus a detonation in a desired direction, and h...
Microstructural deformation mechanisms present during three different forming processes in commercia...
Laser cladding deposition (LCD) is widely used to remanufacture/repair workpieces because of its hig...
The metal injection molding (MIM) method was applied to manufacture a shaped charge liner (SCL) used...
K220 copper parts were produced by Selective Laser Melting (SLM) technology. The relative densities ...
Abstract The dynamic response and microstructure evolution of oxygen-free high-conductivity copper i...