Three dimensional inkjet printing of multiple materials for electronics applications are challenging due to the limited material availability, inconsistencies in layer thickness between dissimilar materials and the need to expose the printed tracks of metal nanoparticles to temperature above 100 °C for sintering. It is envisaged that instead of printing a dielectric and a conductive material on the same plane, by printing conductive tracks on an angled dielectric surface, the required number of silver layers and consequently, the exposure of the polymer to high temperature and the build time of the component can be significantly reduced. Conductive tracks printed with a fixed print height (FH) showed significantly better resolution for all ...
International audiencePrinted electronics by inkjet offers enormous potential since it is an additiv...
The production of electronic circuits and devices is limited by current manufacturing methods that l...
Printed electronics (PE) technology shows huge promise for the realisation of low-cost and flexible ...
Three dimensional inkjet printing of multiple materials for electronics applications are challenging...
Three dimensional (3D) inkjet printing of multiple materials is being explored widely to fabricate ...
Despite the advancement of additive manufacturing (AM)/3-dimensional (3D) printing, single-step fabr...
Despite the advancement of additive manufacturing (AM)/3-dimensional (3D) printing, single-step fabr...
The move to multi-functionality in Additive Manufacturing converges a number of technical challenge...
Introduction: The ever-growing need for fast prototypes and reduced manufacturing throughput times i...
In this study we investigate the inkjet printing of a silver nanoparticle ink and the optimization ...
The production of electronic circuits and devices is limited by current manufacturing methods that l...
A new manufacturing paradigm may lower the cost and environmental impact of existing products, as we...
The sintering of elements performed with the inkjet printing technique is one of the stages of flexi...
In this study we investigate the inkjet printing of a silver nanoparticle ink and the optimization o...
Multi-material 3D inkjet printing has great potential for rapid prototyping and manufacturing of fu...
International audiencePrinted electronics by inkjet offers enormous potential since it is an additiv...
The production of electronic circuits and devices is limited by current manufacturing methods that l...
Printed electronics (PE) technology shows huge promise for the realisation of low-cost and flexible ...
Three dimensional inkjet printing of multiple materials for electronics applications are challenging...
Three dimensional (3D) inkjet printing of multiple materials is being explored widely to fabricate ...
Despite the advancement of additive manufacturing (AM)/3-dimensional (3D) printing, single-step fabr...
Despite the advancement of additive manufacturing (AM)/3-dimensional (3D) printing, single-step fabr...
The move to multi-functionality in Additive Manufacturing converges a number of technical challenge...
Introduction: The ever-growing need for fast prototypes and reduced manufacturing throughput times i...
In this study we investigate the inkjet printing of a silver nanoparticle ink and the optimization ...
The production of electronic circuits and devices is limited by current manufacturing methods that l...
A new manufacturing paradigm may lower the cost and environmental impact of existing products, as we...
The sintering of elements performed with the inkjet printing technique is one of the stages of flexi...
In this study we investigate the inkjet printing of a silver nanoparticle ink and the optimization o...
Multi-material 3D inkjet printing has great potential for rapid prototyping and manufacturing of fu...
International audiencePrinted electronics by inkjet offers enormous potential since it is an additiv...
The production of electronic circuits and devices is limited by current manufacturing methods that l...
Printed electronics (PE) technology shows huge promise for the realisation of low-cost and flexible ...