We propose a strategy to reduce the propagation delay of microprocessors’ digital bus lines at very low costs in terms of area overhead, power consumption and power-delay product. Likewise some solutions adopted in industry nowadays, our strategy inserts in the bus lines repeaters implemented as a chain of inverters with increasing size. In this paper, we derive new expressions to determine the optimum number of inverters to be used within each repeater, and the optimum number of repeaters to insert in the bus lines. Our derived expressions yield to bus implementations with significant lower cost in terms of area overhead and power consumption than alternative solutions in literature. Considering a 32 nm technology as a significant example,...
The Design Automation and Test in Europe, DATE, is Europe’s leading international electronic systems...
In this study we created a new routing fabric for reducing power and delay. The power consumed in a ...
The viability of bus interconnection models is explored, using the multiple-valued logic (MVL) parad...
Abstract — This paper1 proposes a bus-segmentation method that efficiently reduces the switched capa...
This book provides practical solutions for delay and power reduction for on-chip interconnects and b...
Shared-bus chip multiprocessors require buses with long wires. The portion of power consumed in wire...
Previously reported bus encoding approaches reduce crosstalk delay but they ignore the effects of in...
This paper describes a low-power design methodology for a bus architecture based on hybrid current/v...
Abstract — In deep-submicron (DSM) technology, minimizing power consumption of a bus is one of the m...
As technology scales down, coupling between nodes of the circuits increases and becomes an important...
Technology trends and especially portable applications are adding a third dimension (power) to the p...
University of Minnesota Ph.D. dissertation. November 2008. Major: Electrical Engineering. Advisor: G...
Interconnects on deep submicron (DSM) buses incur significantly larger power dissipation, delay perf...
International audienceInterconnects are now considered as the bottleneck in the design of system-on-...
Abstract — Sub-micron feature sizes have resulted in a considerable portion of power to be dissipate...
The Design Automation and Test in Europe, DATE, is Europe’s leading international electronic systems...
In this study we created a new routing fabric for reducing power and delay. The power consumed in a ...
The viability of bus interconnection models is explored, using the multiple-valued logic (MVL) parad...
Abstract — This paper1 proposes a bus-segmentation method that efficiently reduces the switched capa...
This book provides practical solutions for delay and power reduction for on-chip interconnects and b...
Shared-bus chip multiprocessors require buses with long wires. The portion of power consumed in wire...
Previously reported bus encoding approaches reduce crosstalk delay but they ignore the effects of in...
This paper describes a low-power design methodology for a bus architecture based on hybrid current/v...
Abstract — In deep-submicron (DSM) technology, minimizing power consumption of a bus is one of the m...
As technology scales down, coupling between nodes of the circuits increases and becomes an important...
Technology trends and especially portable applications are adding a third dimension (power) to the p...
University of Minnesota Ph.D. dissertation. November 2008. Major: Electrical Engineering. Advisor: G...
Interconnects on deep submicron (DSM) buses incur significantly larger power dissipation, delay perf...
International audienceInterconnects are now considered as the bottleneck in the design of system-on-...
Abstract — Sub-micron feature sizes have resulted in a considerable portion of power to be dissipate...
The Design Automation and Test in Europe, DATE, is Europe’s leading international electronic systems...
In this study we created a new routing fabric for reducing power and delay. The power consumed in a ...
The viability of bus interconnection models is explored, using the multiple-valued logic (MVL) parad...