none5noSingle layer thin-film materials such as aluminum, polyethylene, polypropylene, and their multi-layer combinations such as aluminum-paper have been exposed to different laser radiation. A wide number of samples have been processed with 10 - 12.5 ns IR and Green, and 500 - 800 ps IR laser radiation at different translating speeds ranging from 50 mm/s to 1 m/s. High quality incisions have been obtained for all tested materials within the experimental conditions. The presented results provide the necessary parameters for an efficient cut and processing of the tested materials, for the employment of pulsed laser sources in the packaging industry, allowing the laser to prevail in lieu of more costly and energy intensive methods. © 2014 SP...
Pulsed laser deposition as a method of physical vapour deposition suitable for the deposition of thi...
In this work, we present a systematic study of laser processing of metallized papers (MPs) as a simp...
The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part o...
none6noTranslating single and multi-layer packaging films are exposed to 0.5–0.8 ns laser pulses of ...
Translating single and multi-layer packaging films are exposed to 0.5–0.8 ns laser pulses of wavelen...
Translating single and multi-layer packaging films are exposed to 0.5–0.8 ns laser pulses of wavelen...
Translating single and multi-layer packaging films are exposed to 0.5-0.8 ns laser pulses of wavelen...
Translating single and multi-layer packaging films are exposed to 0.5-0.8 ns laser pulses of wavelen...
The present work deals with the high-power diode laser joining process of aluminum films coated with...
The present work studies the joining process by high power diode laser of aluminum films coated with...
The present work deals with the high-power diode laser joining process of aluminum films coated with...
The present work deals with the high-power diode laser joining process of aluminum films coated with...
This paper describes a mechatronic approach to the design and implementation of a noncontact sealing...
resins with films in plastic and bioplastic materials. This study is part of the development of new ...
resins with films in plastic and bioplastic materials. This study is part of the development of new ...
Pulsed laser deposition as a method of physical vapour deposition suitable for the deposition of thi...
In this work, we present a systematic study of laser processing of metallized papers (MPs) as a simp...
The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part o...
none6noTranslating single and multi-layer packaging films are exposed to 0.5–0.8 ns laser pulses of ...
Translating single and multi-layer packaging films are exposed to 0.5–0.8 ns laser pulses of wavelen...
Translating single and multi-layer packaging films are exposed to 0.5–0.8 ns laser pulses of wavelen...
Translating single and multi-layer packaging films are exposed to 0.5-0.8 ns laser pulses of wavelen...
Translating single and multi-layer packaging films are exposed to 0.5-0.8 ns laser pulses of wavelen...
The present work deals with the high-power diode laser joining process of aluminum films coated with...
The present work studies the joining process by high power diode laser of aluminum films coated with...
The present work deals with the high-power diode laser joining process of aluminum films coated with...
The present work deals with the high-power diode laser joining process of aluminum films coated with...
This paper describes a mechatronic approach to the design and implementation of a noncontact sealing...
resins with films in plastic and bioplastic materials. This study is part of the development of new ...
resins with films in plastic and bioplastic materials. This study is part of the development of new ...
Pulsed laser deposition as a method of physical vapour deposition suitable for the deposition of thi...
In this work, we present a systematic study of laser processing of metallized papers (MPs) as a simp...
The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part o...