Metal gate technology is a key enabler for continued transistor scaling and is essential to proper operation of emerging multiple-gate architectures. Work-function variability (WFV) associated to the granular structure of TiN gates in a LSTP-32nm FinFET is studied through quantum-corrected hydrodynamic simulations. These provide physical insight on the impact of grain size and position, highlighting the crucial role of the source gate side and showing theoretical as well as practical shortcomings of previous WFV models based of the area-weighted average WF concept. 2D slices with random gate configuration are paralleled to simulate the impact of gate non-uniformities along the fin height. Electrical parameter distributions are extracted fro...
Four sources of variability, metal grain granularity (MGG), line-edge roughness (LER), gate-edge rou...
In this paper, we analyze the variability of III-V homojunction tunnel FET (TFET) and FinFET devices...
The impact of fin line-edge roughness on threshold voltage and drive current of LSTP-32nm Fin-FETs i...
We report the numerical simulation study on the characteristic variability of 10-nm SOI Multi Fin n-...
Threshold voltage ðVT Þ and drive current ðIONÞ variability of low stand-by power (LSTP)-32 nm FinFE...
Intra-die fluctuations in the nanoscale CMOS technology emerge inherently to geometrical variations ...
The fin-edge roughness and the TiN metal grain work function-induced variability affecting device ch...
FinFETs may start to replace planar MOSFETs for specific applications at the 32nm node and beyond du...
Estimation of threshold voltage V-T variability for NWFETs has been computationally expensive due to...
none3noWhile traditional scaling used to be accompanied by an improvement in device performance, thi...
This paper presents a comprehensive simulation study of the interactions between long-range process ...
none5Parameter variations pose an increasingly challenging threat to the CMOS technology scaling. Am...
Metal gate granularity (MGG)-induced threshold voltage variability is the dominant source of variabi...
The fin-edge roughness (FER) and the TiN metal grain work function (MGW)-induced variability affecti...
session: nanoelectronic devicesInternational audienceWe expanded our analytical compact model for th...
Four sources of variability, metal grain granularity (MGG), line-edge roughness (LER), gate-edge rou...
In this paper, we analyze the variability of III-V homojunction tunnel FET (TFET) and FinFET devices...
The impact of fin line-edge roughness on threshold voltage and drive current of LSTP-32nm Fin-FETs i...
We report the numerical simulation study on the characteristic variability of 10-nm SOI Multi Fin n-...
Threshold voltage ðVT Þ and drive current ðIONÞ variability of low stand-by power (LSTP)-32 nm FinFE...
Intra-die fluctuations in the nanoscale CMOS technology emerge inherently to geometrical variations ...
The fin-edge roughness and the TiN metal grain work function-induced variability affecting device ch...
FinFETs may start to replace planar MOSFETs for specific applications at the 32nm node and beyond du...
Estimation of threshold voltage V-T variability for NWFETs has been computationally expensive due to...
none3noWhile traditional scaling used to be accompanied by an improvement in device performance, thi...
This paper presents a comprehensive simulation study of the interactions between long-range process ...
none5Parameter variations pose an increasingly challenging threat to the CMOS technology scaling. Am...
Metal gate granularity (MGG)-induced threshold voltage variability is the dominant source of variabi...
The fin-edge roughness (FER) and the TiN metal grain work function (MGW)-induced variability affecti...
session: nanoelectronic devicesInternational audienceWe expanded our analytical compact model for th...
Four sources of variability, metal grain granularity (MGG), line-edge roughness (LER), gate-edge rou...
In this paper, we analyze the variability of III-V homojunction tunnel FET (TFET) and FinFET devices...
The impact of fin line-edge roughness on threshold voltage and drive current of LSTP-32nm Fin-FETs i...