Add to ORKGA wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional transmission capabilities for 3D system integration. Chips are implemented in 0.13mum CMOS and assembled face-to-face. RX-TX circuits are connected by 8times8mum 2 electrodes and this enables the vertical propagation of clock at 17GHz, a propagation delay of 420ps for general purpose signals and a throughput of more than 22Mb/s/mum2 with 0.08pJ/b energy consumption
Abstract—In recent 3DIC studies, through silicon vias (TSV) are usually employed as the vertical int...
A memory interface for a 3D System-on-a-Chip based on capacitive coupling is implemented in 90nm CMO...
With the emergence of Internet of Things and information revolution, the demand of high performance ...
A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional tra...
A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional tra...
A 3D interconnection scheme based on capacitive coupling for high speed chip to chip communication h...
3D contactless technology based on capacitive coupling represents a promising solution for high-spee...
Chip-to-chip interconnection, based on wireless communication by capacitive coupling was investigate...
Capacitive-coupling-based simultaneously bi-directional transceivers for chip-to-chip communication ...
This paper presents a 3-D interconnection scheme based on capacitive coupling. We propose synchronou...
This paper presents a synchronous 3D interconnection based on capacitive coupling. The designed link...
This paper presents a review of the solutions proposed for chip-to-chip communication ba...
The mobile market is growing rapidly, as is the demand for high performance and multiple functions i...
With the continuous downsizing of CMOS technology, various components such as processors, memories, ...
Three dimensional system integration is a promising enabling technology for realising heterogeneous ...
Abstract—In recent 3DIC studies, through silicon vias (TSV) are usually employed as the vertical int...
A memory interface for a 3D System-on-a-Chip based on capacitive coupling is implemented in 90nm CMO...
With the emergence of Internet of Things and information revolution, the demand of high performance ...
A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional tra...
A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional tra...
A 3D interconnection scheme based on capacitive coupling for high speed chip to chip communication h...
3D contactless technology based on capacitive coupling represents a promising solution for high-spee...
Chip-to-chip interconnection, based on wireless communication by capacitive coupling was investigate...
Capacitive-coupling-based simultaneously bi-directional transceivers for chip-to-chip communication ...
This paper presents a 3-D interconnection scheme based on capacitive coupling. We propose synchronou...
This paper presents a synchronous 3D interconnection based on capacitive coupling. The designed link...
This paper presents a review of the solutions proposed for chip-to-chip communication ba...
The mobile market is growing rapidly, as is the demand for high performance and multiple functions i...
With the continuous downsizing of CMOS technology, various components such as processors, memories, ...
Three dimensional system integration is a promising enabling technology for realising heterogeneous ...
Abstract—In recent 3DIC studies, through silicon vias (TSV) are usually employed as the vertical int...
A memory interface for a 3D System-on-a-Chip based on capacitive coupling is implemented in 90nm CMO...
With the emergence of Internet of Things and information revolution, the demand of high performance ...