Carbon nanotubes (CNTs) have been widely proposed as interconnect fabric for nano and very deep submicron (silicon-based) technologies due to their robustness to electromigration. In this paper, issues associated with crosstalk among bus lines implemented by CNTs are investigated in detail. CNT-based interconnects are modeled and the effects of crosstalk on performance and correct operation are evaluated by simulation. Existing models are modified to account for geometries in bus architectures made of parallel single-walled nanotubes and a single multiwalled nanotube. New RLC equivalent circuits are proposed for these bus architectures. A novel bus architecture with low crosstalk features is also proposed. This bus architecture is ...
The aroused quest to reduce the delay at the interconnect level is the main urge of this paper, so a...
The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects ...
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming ...
Carbon nanotubes (CNTs) have been widely proposed as interconnect fabric for nano and very deep sub...
Carbon nanotubes (CNTs) have been widely proposed as interconnect fabric for nano and very deep subm...
Carbon Nano Tubes (CNTs) have been widely proposed as interconnect fabric for nano and very deep sub...
In this paper, the crosstalk problem for carbon nanotubes (CNTs) bundled interconnects ismodeled in ...
Multi-walled carbon nanotube (MWCNT) bundles have potentially provided attractive solutions in curre...
In this paper, the crosstalk problem for carbon nanotubes (CNTs) bundle interconnects is dealt with....
In future nanoscale integrated circuits, process technology scaling coupled with increasing operatin...
Abstract—Metallic carbon nanotubes (CNTs) have received much attention for their unique characterist...
The brief primarily focuses on the performance analysis of CNT based interconnects in current resear...
Abstract—This paper presents a comprehensive study of the ap-plicability of single-walled carbon nan...
The size reduction of copper interconnects degrades their performances due to increased surface scat...
The aroused quest to reduce the delay at the interconnect level is the main urge of this paper, so a...
The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects ...
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming ...
Carbon nanotubes (CNTs) have been widely proposed as interconnect fabric for nano and very deep sub...
Carbon nanotubes (CNTs) have been widely proposed as interconnect fabric for nano and very deep subm...
Carbon Nano Tubes (CNTs) have been widely proposed as interconnect fabric for nano and very deep sub...
In this paper, the crosstalk problem for carbon nanotubes (CNTs) bundled interconnects ismodeled in ...
Multi-walled carbon nanotube (MWCNT) bundles have potentially provided attractive solutions in curre...
In this paper, the crosstalk problem for carbon nanotubes (CNTs) bundle interconnects is dealt with....
In future nanoscale integrated circuits, process technology scaling coupled with increasing operatin...
Abstract—Metallic carbon nanotubes (CNTs) have received much attention for their unique characterist...
The brief primarily focuses on the performance analysis of CNT based interconnects in current resear...
Abstract—This paper presents a comprehensive study of the ap-plicability of single-walled carbon nan...
The size reduction of copper interconnects degrades their performances due to increased surface scat...
The aroused quest to reduce the delay at the interconnect level is the main urge of this paper, so a...
The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects ...
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming ...