Boron ultra low energy (0.2-3 keV) implants in silicon have been characterized by a combined approach of secondary ion mass spectrometry (SIMS) and synchrotron radiation grazing incidence x-ray fluorescence (SR-GIXRF). SIMS analysis was carried out using ultra low energy O2+ beam in either fully or partially oxidizing conditions in order to identify the best approach. The rotation of the sample was applied to prevent or reduce the formation of roughness on the SIMS crater bottom and prevent strong variations of erosion rate. The resulting dose values were cross checked with the independently determined values from SRGIXRF analysis and revealed a good alignment between the techinques
Ultra-shallow junction formation in deep submicron Si devices is limited by anomalous diffusion of t...
In very recent years particular effort is being devoted to the development of radiofrequency (rf) pu...
Dopant depth profiling and dose determination are essential for ultrashallow junction technology dev...
Boron ultralow energy (0.2–3 keV) high dose (1E15 cm−2) implants in single crystalline Si (100) were...
Secondary ion mass spectrometry (SIMS) is still one of the reference analytical techniques in order ...
Former results on B ultra shallow junction (USJ) characterization by SIMS revealed that collecting B...
A need for analysis techniques, complementary to secondary ion mass spectrometry (SIMS), for depth p...
A need for analysis techniques, complementary to secondary ion mass spectrometry (SIMS), for depth p...
An ultra high vacuum, low energy ion implanter was used in conjunction with a range of analytical te...
An ultra high vacuum, low energy ion implanter was used in conjunction with a range of analytical te...
Optimization of oblique incidence ultra low energy O2+ SIMS analysis of ultra shallow boron distribu...
In this work a summary of complementary approaches to quantitatively characterize ultra shallow dopa...
The features of ultra-shallow junctions indicated by 2001 International Roadmaps require challenging...
Since the invention of the bipolar transistor in 1947, lateral dimensions of semiconductor devices h...
In very recent years particular effort is being devoted to the development of radiofrequency (rf) pu...
Ultra-shallow junction formation in deep submicron Si devices is limited by anomalous diffusion of t...
In very recent years particular effort is being devoted to the development of radiofrequency (rf) pu...
Dopant depth profiling and dose determination are essential for ultrashallow junction technology dev...
Boron ultralow energy (0.2–3 keV) high dose (1E15 cm−2) implants in single crystalline Si (100) were...
Secondary ion mass spectrometry (SIMS) is still one of the reference analytical techniques in order ...
Former results on B ultra shallow junction (USJ) characterization by SIMS revealed that collecting B...
A need for analysis techniques, complementary to secondary ion mass spectrometry (SIMS), for depth p...
A need for analysis techniques, complementary to secondary ion mass spectrometry (SIMS), for depth p...
An ultra high vacuum, low energy ion implanter was used in conjunction with a range of analytical te...
An ultra high vacuum, low energy ion implanter was used in conjunction with a range of analytical te...
Optimization of oblique incidence ultra low energy O2+ SIMS analysis of ultra shallow boron distribu...
In this work a summary of complementary approaches to quantitatively characterize ultra shallow dopa...
The features of ultra-shallow junctions indicated by 2001 International Roadmaps require challenging...
Since the invention of the bipolar transistor in 1947, lateral dimensions of semiconductor devices h...
In very recent years particular effort is being devoted to the development of radiofrequency (rf) pu...
Ultra-shallow junction formation in deep submicron Si devices is limited by anomalous diffusion of t...
In very recent years particular effort is being devoted to the development of radiofrequency (rf) pu...
Dopant depth profiling and dose determination are essential for ultrashallow junction technology dev...