As new technological tasks arise, electroless coatings on the basis of cobalt have come into use in microelectronics and micromechanics in order to form a protective layer against copper migration in integral schemes. Copper possesses a low specific resistance, however it also has some disadvantages, such as a low corrosion resistance and a high diffusion coefficient into So and SiO2 as well as into other substances. These problems can be diminished by using a thin barrier layer protecting from copper diffusion. The barrier properties of CoP and CoB layers which can be further improved by addition of tungsten would be suited for this purpose. At present, investigations of this kind are being carried out in many countries. Recently much atte...
Abstract Electrolessly deposited Co (Re,P) was investigated as a possible capping layer for Cu wires...
International audienceThe influence of cobalt on the electrodeposition of zinc onto AISI 1018 steel ...
Electrolessly deposited Co (Re,P) was investigated as a possible capping layer for Cu wires. 50 nm C...
As new technological tasks arise, electroless coatings on the basis of cobalt have come into use in ...
In this study, cobalt-nickel (Co-Ni), cobalt-iron (Co-Fe), cobalt-iron-manganese (Co-Fe-Mn), cobalt-...
Ammonia borane (AB) has been used as a reducing agent in the deposition of cobalt on copper substrat...
This work describes the development of a thin film cobalttungsten–phosphorous (Co–W–P) alloy, deposi...
The requirement for integration into silicon IC circuitry working at GHz frequencies drives the rese...
Co-alloy films with various solution compositions CoB, CoWB, and CoW B P were deposited with an el...
The deposition efficiencies of a number of electroless nickel and cobalt plating solutions were stud...
Thin cobalt alloy films have been obtained using electroless deposition solution with two reducing a...
Electroless deposition of Cu was investigated on thin Co layer for through Si via with high aspect r...
International audienceElcctroless metallic caps are convincing alternatives to standard SiC(N) barri...
xi, 123 leaves : ill. ; 30 cm.PolyU Library Call No.: [THS] LG51 .H577M ABCT 2005 LeeElectroplating ...
LaNi4.27Sn0.24 alloy was microencapsulated with cobalt by electroless deposition from an alkaline hy...
Abstract Electrolessly deposited Co (Re,P) was investigated as a possible capping layer for Cu wires...
International audienceThe influence of cobalt on the electrodeposition of zinc onto AISI 1018 steel ...
Electrolessly deposited Co (Re,P) was investigated as a possible capping layer for Cu wires. 50 nm C...
As new technological tasks arise, electroless coatings on the basis of cobalt have come into use in ...
In this study, cobalt-nickel (Co-Ni), cobalt-iron (Co-Fe), cobalt-iron-manganese (Co-Fe-Mn), cobalt-...
Ammonia borane (AB) has been used as a reducing agent in the deposition of cobalt on copper substrat...
This work describes the development of a thin film cobalttungsten–phosphorous (Co–W–P) alloy, deposi...
The requirement for integration into silicon IC circuitry working at GHz frequencies drives the rese...
Co-alloy films with various solution compositions CoB, CoWB, and CoW B P were deposited with an el...
The deposition efficiencies of a number of electroless nickel and cobalt plating solutions were stud...
Thin cobalt alloy films have been obtained using electroless deposition solution with two reducing a...
Electroless deposition of Cu was investigated on thin Co layer for through Si via with high aspect r...
International audienceElcctroless metallic caps are convincing alternatives to standard SiC(N) barri...
xi, 123 leaves : ill. ; 30 cm.PolyU Library Call No.: [THS] LG51 .H577M ABCT 2005 LeeElectroplating ...
LaNi4.27Sn0.24 alloy was microencapsulated with cobalt by electroless deposition from an alkaline hy...
Abstract Electrolessly deposited Co (Re,P) was investigated as a possible capping layer for Cu wires...
International audienceThe influence of cobalt on the electrodeposition of zinc onto AISI 1018 steel ...
Electrolessly deposited Co (Re,P) was investigated as a possible capping layer for Cu wires. 50 nm C...