The Vertical Strained Silicon Germanium (SiGe) Impact Ionization MOSFET with Dielectric Pocket (VESIMOS-DP) has been successfully developed and analyzed in this paper. Due to the DP layer, improve stability of threshold voltage, VT was found for VESIMOS-DP device of various DP size ranging from 20nm to 80nm. The stability is due to the reducing charge sharing effects between source and drain region. However, the presence of DP layer has introduced another potential barrier in addition to δp+ triangular potential barrier. Thus, increased amount of gate source voltage for lowering both barriers and allows the electron to move from source to drain. Accordingly, slight different and consistency of VESIMOS-DP sub-threshold value as compared to ...
Characterization of a metal-oxide-semiconductor field effect transistor (MOSFET) incorporating diele...
textFor over three decades, the Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) has succ...
Two trench-gated power MOSFETs using strained SiGe channel are proposed to further reduce specific o...
Fast switching with an enhanced reliability device structure of Vertical Strained Impact Ionization ...
The Single and Dual Strained SiGe layer for Vertical Strained Silicon Germanium (SiGe) Impact Ioniza...
The Vertical Strained Silicon Germanium (SiGe) Impact Ionization MOSFET (VESIMOS) has been successfu...
Miniaturization of semiconductor devices beyond sub-l00nm has commenced several problems for further...
In this paper, we propose a fabrication process of Strained Silicon MOSFET incorporating Dielectric ...
The Single and Dual Strained SiGe layer for Vertical Strained Silicon Germanium (SiGe) Impact Ioniza...
Miniaturization of semiconductor devices beyond sub-lO0nm has commenced several problems for further...
This paper gives an overview about uniqueness characteristics of Vertical Strained Impact Ionization...
Characterization of nanoscale planar and vertical metal-oxide-semiconductor field effect transistor ...
Characterization of nanoscale planar and vertical metal-oxide-semiconductor field effect transistor ...
This paper venture into prospective ideas of finding viable solution of nanoelectronics device desig...
Characterization of a metal-oxide-semiconductor field effect transistor (MOSFET) incorporating diele...
Characterization of a metal-oxide-semiconductor field effect transistor (MOSFET) incorporating diele...
textFor over three decades, the Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) has succ...
Two trench-gated power MOSFETs using strained SiGe channel are proposed to further reduce specific o...
Fast switching with an enhanced reliability device structure of Vertical Strained Impact Ionization ...
The Single and Dual Strained SiGe layer for Vertical Strained Silicon Germanium (SiGe) Impact Ioniza...
The Vertical Strained Silicon Germanium (SiGe) Impact Ionization MOSFET (VESIMOS) has been successfu...
Miniaturization of semiconductor devices beyond sub-l00nm has commenced several problems for further...
In this paper, we propose a fabrication process of Strained Silicon MOSFET incorporating Dielectric ...
The Single and Dual Strained SiGe layer for Vertical Strained Silicon Germanium (SiGe) Impact Ioniza...
Miniaturization of semiconductor devices beyond sub-lO0nm has commenced several problems for further...
This paper gives an overview about uniqueness characteristics of Vertical Strained Impact Ionization...
Characterization of nanoscale planar and vertical metal-oxide-semiconductor field effect transistor ...
Characterization of nanoscale planar and vertical metal-oxide-semiconductor field effect transistor ...
This paper venture into prospective ideas of finding viable solution of nanoelectronics device desig...
Characterization of a metal-oxide-semiconductor field effect transistor (MOSFET) incorporating diele...
Characterization of a metal-oxide-semiconductor field effect transistor (MOSFET) incorporating diele...
textFor over three decades, the Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) has succ...
Two trench-gated power MOSFETs using strained SiGe channel are proposed to further reduce specific o...