2D-NoCs have been the mainstream approach used to interconnect multi-core systems. 3D-NoCs have emerged to compensate for deficiencies of 2D-NoCs such as long latency and power overhead. A low-latency routing algorithm for 3D-NoC is designed to accommodate high-speed communication between cores. Both simulation and analytical models are applied to estimate the communication latency of NoCs. Generally, simulations are time-consuming and slow down the design process. Analytical models provide, within a fraction of the time, nearly accurate results which can be used by simulation to fine-tune the design. In this paper, a high performance and adaptive routing algorithm has been proposed for partially connected 3D-NoCs. Latency of the routing al...
Abstract — Network on Chip (NoC) is a new paradigm to make the interconnections inside a System on C...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
The combination of three-dimensional integrated circuits (3D ICs) and Networks-on-Chip (NoCs) offers...
2D-NoCs have been the mainstream approach used to interconnect multi-core systems. 3D-NoCs have emer...
2D Network-on-Chips (NoCs) have been the mainstream interconnection technology for multi-core system...
International audienceExisting routing algorithms for 3D deal with regular mesh/torus 3D topologies....
3D ICs can take advantage of a scalable communication platform, commonly referred to as the Networks...
To meet the performance and scalability demands of the fast-paced technological growth towards exasc...
Three-Dimensional (3D) integration is a solution to the interconnect bottleneck in Two-Dimensional (...
Abstract—Three-dimensional (3D) integration offers greater device integration, reduced signal delay ...
Three dimensional Networks-on-Chip (3D NoCs) have attracted a growing interest to solve on-chip comm...
Three-dimensional (3D) integration offers greater device integration, reduced signal delay and reduc...
Recently three-dimensional Networks-on-Chips (3D NoCs) rang-ing from regular to highly irregular top...
Three-dimensional (3D) silicon integration technologies have provided new opportunities for Network-...
For most of the history of computing, transistors have been expensive while wires have been cheap. C...
Abstract — Network on Chip (NoC) is a new paradigm to make the interconnections inside a System on C...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
The combination of three-dimensional integrated circuits (3D ICs) and Networks-on-Chip (NoCs) offers...
2D-NoCs have been the mainstream approach used to interconnect multi-core systems. 3D-NoCs have emer...
2D Network-on-Chips (NoCs) have been the mainstream interconnection technology for multi-core system...
International audienceExisting routing algorithms for 3D deal with regular mesh/torus 3D topologies....
3D ICs can take advantage of a scalable communication platform, commonly referred to as the Networks...
To meet the performance and scalability demands of the fast-paced technological growth towards exasc...
Three-Dimensional (3D) integration is a solution to the interconnect bottleneck in Two-Dimensional (...
Abstract—Three-dimensional (3D) integration offers greater device integration, reduced signal delay ...
Three dimensional Networks-on-Chip (3D NoCs) have attracted a growing interest to solve on-chip comm...
Three-dimensional (3D) integration offers greater device integration, reduced signal delay and reduc...
Recently three-dimensional Networks-on-Chips (3D NoCs) rang-ing from regular to highly irregular top...
Three-dimensional (3D) silicon integration technologies have provided new opportunities for Network-...
For most of the history of computing, transistors have been expensive while wires have been cheap. C...
Abstract — Network on Chip (NoC) is a new paradigm to make the interconnections inside a System on C...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
The combination of three-dimensional integrated circuits (3D ICs) and Networks-on-Chip (NoCs) offers...