We report on the reduction of the thermal conductivity in ultra-thin suspended Si membranes with high crystalline quality. A series of membranes with thicknesses ranging from 9 nm to 1.5 μm was investigated using Raman thermometry, a novel contactless technique for thermal conductivity determination. A systematic decrease in the thermal conductivity was observed as reducing the thickness, which is explained using the Fuchs-Sondheimer model through the influence of phonon boundary scattering at the surfaces. The thermal conductivity of the thinnest membrane with d = 9 nm resulted in (9 ± 2) W/mK, thus approaching the amorphous limit but still maintaining a high crystalline quality
Nanostructuring provides a viable route to improve the thermoelectric performance of materials, even...
International audienceThe thermal properties of suspended thin films prepared by the micro-machining...
Nanostructured silicon is a promising material for thermoelectric conversion because the thermal con...
Under the terms of the Creative Commons Attribution (CC BY) license to their work.We report on the r...
We report on the reduction of the thermal conductivity in ultra-thin suspended Si membranes with hig...
Heat conduction in silicon can be effectively engineered by means of sub-micrometre porous thin free...
We present a novel contactless technique for thermal conductivity determination and thermal field ma...
This is an open access article published under an ACS AuthorChoice License. See Standard ACS AuthorC...
International audienceWe characterize nanometer-thin suspended silicon membranes in the pristine sta...
A detailed understanding of the connections of fabrication and processing to structural and thermal ...
A detailed understanding of the connections of fabrication and processing to structural and thermal ...
Resumen del trabajo presentado al XXXth International Winterschool on Electronics Properties of Nove...
Under the terms of the Creative Commons Attribution (CC BY) license to their work.We present a novel...
Altres ajuts: CERCA program/Generalitat de CatalunyaIn this work we study the effects of disorder on...
Knowledge of the mean-free-path distribution of heat-carrying phonons is key to understanding phonon...
Nanostructuring provides a viable route to improve the thermoelectric performance of materials, even...
International audienceThe thermal properties of suspended thin films prepared by the micro-machining...
Nanostructured silicon is a promising material for thermoelectric conversion because the thermal con...
Under the terms of the Creative Commons Attribution (CC BY) license to their work.We report on the r...
We report on the reduction of the thermal conductivity in ultra-thin suspended Si membranes with hig...
Heat conduction in silicon can be effectively engineered by means of sub-micrometre porous thin free...
We present a novel contactless technique for thermal conductivity determination and thermal field ma...
This is an open access article published under an ACS AuthorChoice License. See Standard ACS AuthorC...
International audienceWe characterize nanometer-thin suspended silicon membranes in the pristine sta...
A detailed understanding of the connections of fabrication and processing to structural and thermal ...
A detailed understanding of the connections of fabrication and processing to structural and thermal ...
Resumen del trabajo presentado al XXXth International Winterschool on Electronics Properties of Nove...
Under the terms of the Creative Commons Attribution (CC BY) license to their work.We present a novel...
Altres ajuts: CERCA program/Generalitat de CatalunyaIn this work we study the effects of disorder on...
Knowledge of the mean-free-path distribution of heat-carrying phonons is key to understanding phonon...
Nanostructuring provides a viable route to improve the thermoelectric performance of materials, even...
International audienceThe thermal properties of suspended thin films prepared by the micro-machining...
Nanostructured silicon is a promising material for thermoelectric conversion because the thermal con...