Ni/Al/Ti ohmic contacts with preserved form factor during alloying at 1000 °C, almost constant specific resistance value in the low 10-4 Ohmxcm2 decade, and a very weak temperature dependence in the range 25 - 290 °C, have been obtained on 1x 1020 cm-3 Al+implanted p-type 4H-SiC of different resistivity in the range 6 x10-2- 1 Ohmxcm2. A qualitative data analysis for understanding the hole transport mechanism through the formed metal/semiconductor interface is also shown
The excellent electrical and thermal properties of SiC make it a preferable semiconductor material f...
Effects of reducing annealing temperature on a technique for the simultaneous formation of Ni/Al ohm...
This paper presents an experimental investigation into different metallisation structures aimed at r...
International audienceInvestigations on Ni-Al alloys to form ohmic contacts on p-type 4H-SiC are pre...
International audienceInvestigations on Ni/Al alloys to form ohmic contacts to p-type 4H-SiC are pre...
In this paper, an experimental investigation into titanium (Ti) / aluminium (Al)-based ohmic contac...
TLM structures on Al-implanted regions with different implanted Al concentrations and different anne...
International audienceTransfer Length Method (TLM) based-structures were fabricated on 0.8 µm-thick ...
This study shows that a thin Ni film on Al/Ti/4H-SiC metal pads allows to preserve the pad form fact...
This paper presents a detailed physical and electrical analysis of 4H-SiC ohmic contacts to p-type m...
The fabrication of low-resistance and thermal stable ohmic contacts is important for realization of ...
In this work, we have investigated triple and innovative multiple stacked contacts onto p-type SiC i...
This paper describes successfully formed ohmic contacts to p-type 4H-SiC based on titanium-aluminum ...
International audienceThe stability and reliability at high temperature of Ti3SiC2 based ohmic conta...
In this paper, an experimental investigation into titanium (Ti) / aluminium (Al)-based ohmic contact...
The excellent electrical and thermal properties of SiC make it a preferable semiconductor material f...
Effects of reducing annealing temperature on a technique for the simultaneous formation of Ni/Al ohm...
This paper presents an experimental investigation into different metallisation structures aimed at r...
International audienceInvestigations on Ni-Al alloys to form ohmic contacts on p-type 4H-SiC are pre...
International audienceInvestigations on Ni/Al alloys to form ohmic contacts to p-type 4H-SiC are pre...
In this paper, an experimental investigation into titanium (Ti) / aluminium (Al)-based ohmic contac...
TLM structures on Al-implanted regions with different implanted Al concentrations and different anne...
International audienceTransfer Length Method (TLM) based-structures were fabricated on 0.8 µm-thick ...
This study shows that a thin Ni film on Al/Ti/4H-SiC metal pads allows to preserve the pad form fact...
This paper presents a detailed physical and electrical analysis of 4H-SiC ohmic contacts to p-type m...
The fabrication of low-resistance and thermal stable ohmic contacts is important for realization of ...
In this work, we have investigated triple and innovative multiple stacked contacts onto p-type SiC i...
This paper describes successfully formed ohmic contacts to p-type 4H-SiC based on titanium-aluminum ...
International audienceThe stability and reliability at high temperature of Ti3SiC2 based ohmic conta...
In this paper, an experimental investigation into titanium (Ti) / aluminium (Al)-based ohmic contact...
The excellent electrical and thermal properties of SiC make it a preferable semiconductor material f...
Effects of reducing annealing temperature on a technique for the simultaneous formation of Ni/Al ohm...
This paper presents an experimental investigation into different metallisation structures aimed at r...