The effect of chemical–mechanical polishing and high-temperature furnace annealing at temperatures ranging from 1000 °C to 1600 °C on nitrogen-doped crystalline 4H:SiC was investigated. Techniques used to characterize the samples included environmental scanning electron microscopy (ESEM), energy-dispersive X-ray spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS) and micro-Raman spectroscopy. The ESEM micrographs and EDS data indicated that there were structural defects on the unannealed sample that did not propagate into the sample or vary in composition from the bulk. The sample annealed at 1000 °C showed oxygen-rich and carbon-depleted surface defects. Annealing at temperatures above 1200 °C introduced defects that grew out of the...
The influence of two types of structural defects on Schottky diodes in 4H-SiC is investigated. First...
Recent development of device fabrication of SiC is awaiting detailed study of the machining of the s...
The development of defect populations after proton irradiation of n-type 4H-SiC and subsequent annea...
The effect of chemical-mechanical polishing and high temperature furnace annealing on nitrogen-doped...
The effects of Chem-Mechanical Polishing (CMP) and Rapid Thermal Annealing (RTA) on n-type 4H:SiC sa...
In this paper, the impact of high-temperature annealing of 4H silicon carbide (SiC) on the formation...
Low temperature annealing of electron irradiation-induced deep levels in 4H-SiC is reported. The maj...
4H-SiC is one of the most promising indirect wide-bandgap (3.3 eV) semiconductor for power devices u...
A high density of planar defects is observed by scanning and transmission electron microscopy in wa...
The quality of the N-doped 4H-SiC homoepitaxial layers grown via hot-wall horizontal chemical vapor ...
This study focuses on the effects of a high temperature anneal after dry etching of trenches (post-t...
SiC has immense potential as the semiconductor for future metal–oxide–semiconductor (MOS) devices. O...
The effects of low-temperature annealing in 8.2 MeV electron-irradiated 4H-SiC Schottky diodes were...
Despite the promising properties, the problem of cubic silicon carbide (3C-SiC) heteroepitaxy on sil...
Raman spectroscopy and sheet resistance measurements were used to study the preparation processes of...
The influence of two types of structural defects on Schottky diodes in 4H-SiC is investigated. First...
Recent development of device fabrication of SiC is awaiting detailed study of the machining of the s...
The development of defect populations after proton irradiation of n-type 4H-SiC and subsequent annea...
The effect of chemical-mechanical polishing and high temperature furnace annealing on nitrogen-doped...
The effects of Chem-Mechanical Polishing (CMP) and Rapid Thermal Annealing (RTA) on n-type 4H:SiC sa...
In this paper, the impact of high-temperature annealing of 4H silicon carbide (SiC) on the formation...
Low temperature annealing of electron irradiation-induced deep levels in 4H-SiC is reported. The maj...
4H-SiC is one of the most promising indirect wide-bandgap (3.3 eV) semiconductor for power devices u...
A high density of planar defects is observed by scanning and transmission electron microscopy in wa...
The quality of the N-doped 4H-SiC homoepitaxial layers grown via hot-wall horizontal chemical vapor ...
This study focuses on the effects of a high temperature anneal after dry etching of trenches (post-t...
SiC has immense potential as the semiconductor for future metal–oxide–semiconductor (MOS) devices. O...
The effects of low-temperature annealing in 8.2 MeV electron-irradiated 4H-SiC Schottky diodes were...
Despite the promising properties, the problem of cubic silicon carbide (3C-SiC) heteroepitaxy on sil...
Raman spectroscopy and sheet resistance measurements were used to study the preparation processes of...
The influence of two types of structural defects on Schottky diodes in 4H-SiC is investigated. First...
Recent development of device fabrication of SiC is awaiting detailed study of the machining of the s...
The development of defect populations after proton irradiation of n-type 4H-SiC and subsequent annea...