The CMOS planar technology has been used in fabrication of integrated circuits in the last decades. However, short channel effects in the subthreshold operation region are becoming a critical restriction to the channel length reduction. With the use of FinFET devices, the scaling increases due to the reduction of short channel effects. The origin of the FinFET arises from the scaling limitations of planar devices, reducing the short-channel effects and continuing the scaling predicted by the Moore’s Law. A variation of the standard FinFET device is the independent-gate FinFET device (IG FinFET), in which two independently connected gates control an unique channel. In this work, the independentgate device was explored as a circuit element us...
In this work, a benchmark for low-power digital applications of a III-V TFET technology platform aga...
Fully Depleted Silicon on Insulator (FDSOI) and Fin Field Effect Transistor (FinFET) are new innovat...
Scaling of the MOSFET face greater challenge by extreme power density due to leakage current in ultr...
Firstly, this work presents an analysis pointing the impacts of the FinFET technology in the transis...
The FinFET technology is widely recognized as the leading alternative to solve problems minimizatio...
The scaling of MOS transistor has been the main manufacturing strategy for improving integrated circ...
The Independent-Gate FinFET is introduced as a novel device structure that combines several innovati...
Circuitos integrados VLSI (Very Large Scale Integration) usando nanotecnologia demandam novos materi...
The aggressive technology and voltage scaling which CMOS-based modern digital circuits are facing in...
In this paper we propose double gate transistor i.e. FINFETS circuits. It is the substitute of bulk ...
The evolution of integrated circuits technologies demands the development of new CAD tools. The trad...
Para manter o desempenho a uma tensão de alimentação reduzida, a tensão de threshold e as dimensões ...
FinFET at 32 nm and beyond is an emerging transistor technology offer interesting delay–power trade...
Abstract—FinFET technology has been proposed as a promising alternative for deep sub-micron CMOS tec...
Standard low power design utilizes a variety of approaches for supply and threshold control to reduc...
In this work, a benchmark for low-power digital applications of a III-V TFET technology platform aga...
Fully Depleted Silicon on Insulator (FDSOI) and Fin Field Effect Transistor (FinFET) are new innovat...
Scaling of the MOSFET face greater challenge by extreme power density due to leakage current in ultr...
Firstly, this work presents an analysis pointing the impacts of the FinFET technology in the transis...
The FinFET technology is widely recognized as the leading alternative to solve problems minimizatio...
The scaling of MOS transistor has been the main manufacturing strategy for improving integrated circ...
The Independent-Gate FinFET is introduced as a novel device structure that combines several innovati...
Circuitos integrados VLSI (Very Large Scale Integration) usando nanotecnologia demandam novos materi...
The aggressive technology and voltage scaling which CMOS-based modern digital circuits are facing in...
In this paper we propose double gate transistor i.e. FINFETS circuits. It is the substitute of bulk ...
The evolution of integrated circuits technologies demands the development of new CAD tools. The trad...
Para manter o desempenho a uma tensão de alimentação reduzida, a tensão de threshold e as dimensões ...
FinFET at 32 nm and beyond is an emerging transistor technology offer interesting delay–power trade...
Abstract—FinFET technology has been proposed as a promising alternative for deep sub-micron CMOS tec...
Standard low power design utilizes a variety of approaches for supply and threshold control to reduc...
In this work, a benchmark for low-power digital applications of a III-V TFET technology platform aga...
Fully Depleted Silicon on Insulator (FDSOI) and Fin Field Effect Transistor (FinFET) are new innovat...
Scaling of the MOSFET face greater challenge by extreme power density due to leakage current in ultr...