Mechanical tests of thin films require novel and sophisticated methods that can address the geometry and microstructure of the films. A new method of micro-tensile testing of MicroElectroMechanical Systems (MEMS) films has been demonstrated. An improved apparatus has been designed and implemented to measure the elastic tensile properties. (Young's modulus, Poisson's ration and tensile strength) of surface micromachined polysilicon specimans. The tensile specimans are dog-bone shaped ending in a large paddle for convenient electrostatic or, in the improved apparatus, UV adhesive gripping. The test section of the specimens is 400µm long with 2µmx50µm cross section. The method employs Atomic Force Microscope (AFM) acquired surface topologies o...
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)Interna...
Microelectromechanical systems (MEMS) technologies are evolving at a rapid rate with increasing acti...
A promising method has been developed to determine micromechanical properties of thin film materials...
Mechanical tests of thin films require novel and sophisticated methods that can address the geometry...
An apparatus has been designed and implemented to measure the elastic tensile properties (Young's mo...
ABSTRACT—An apparatus has been designed and imple-mented to measure the elastic tensile properties (...
A new method for tensile testing of thin films is being developed. An electrostatic grip apparatus w...
A novel, versatile concept of micromachines has been developed to measure the mechanical response of...
International audienceThe measurement of the mechanical properties of materials with submicrometer d...
The measurement of the mechanical properties of submicron sized specimens is extremely challenging d...
The measurement of mechanical properties of thin films is a major issue for the design of reliable m...
The characterization and understanding of the mechanical response of freestanding nano-objects are o...
International audienceThis paper describes a microtensile test system and the design as the realizat...
The issue of mechanical characterization of polysilicon used in Micro Electro Mechanical Systems (M...
This study is focused on the mechanical characterization of materials used in microelectronic and mi...
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)Interna...
Microelectromechanical systems (MEMS) technologies are evolving at a rapid rate with increasing acti...
A promising method has been developed to determine micromechanical properties of thin film materials...
Mechanical tests of thin films require novel and sophisticated methods that can address the geometry...
An apparatus has been designed and implemented to measure the elastic tensile properties (Young's mo...
ABSTRACT—An apparatus has been designed and imple-mented to measure the elastic tensile properties (...
A new method for tensile testing of thin films is being developed. An electrostatic grip apparatus w...
A novel, versatile concept of micromachines has been developed to measure the mechanical response of...
International audienceThe measurement of the mechanical properties of materials with submicrometer d...
The measurement of the mechanical properties of submicron sized specimens is extremely challenging d...
The measurement of mechanical properties of thin films is a major issue for the design of reliable m...
The characterization and understanding of the mechanical response of freestanding nano-objects are o...
International audienceThis paper describes a microtensile test system and the design as the realizat...
The issue of mechanical characterization of polysilicon used in Micro Electro Mechanical Systems (M...
This study is focused on the mechanical characterization of materials used in microelectronic and mi...
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)Interna...
Microelectromechanical systems (MEMS) technologies are evolving at a rapid rate with increasing acti...
A promising method has been developed to determine micromechanical properties of thin film materials...