We fabricate and characterize bi-metallic structured thin films (~1 um thick) with ultra-low effective coefficient of thermal expansion (CTE). The films consist of a periodic array of aluminum (Al) hexagonal plates attached to a titanium (Ti) frame. In this designed discontinuous geometry, the self-standing films present ultra-low effective CTE through local release of the thermal strains by relative rotation of the lattice elements. We fabricated this structured film by a combination of conventional micro-fabrication process steps, and we measured its CTE as ultra-low (−0.6 × 10^(−6)/°C) using 3D digital image correlation. This new thin film can lead to the creation of low-cost, adaptive structures that operate in extreme thermal environme...
We report the design, fabrication, and characterization of ultralight highly emissive structures wit...
In this article we present the status of our new setup to determine coefficients of thermal expansi...
The coefficient of thermal expansion (CTE), biaxial modulus, and stress of some amorphous semiconduc...
We fabricate and characterize bi-metallic structured thin films (~1 um thick) with ultra-low effecti...
We developed micro-structured thin films with ultra-low coefficient of thermal expansion. These low-...
Ultra-low coefficient of thermal expansion (CTE) is an elusive property, and narrow temperature rang...
Microscale bi-material lattices with near zero thermal expansion are designed to create a thermally ...
We design, fabricate, and test thin thermally stable metastructures consisting of bi-metallic unit c...
[[abstract]]The coefficient of thermal expansion (CTE) is an important mechanical property for thin ...
The coefficient of thermal expansion (CTE) of architected materials, as opposed to that of conventio...
The geometry and constituent materials of metastructures can be used to engineer the thermal expansi...
[[abstract]]In this research, the coefficient of thermal expansion (CTE) of thin films was studied t...
Thermal expansion and lattice parameters are investigated up to 1100 degrees C for Ti-6Al-4V compone...
In this work, we study the thermo-mechanical behavior of metallic structures designed to significant...
A range of engineering alloys was selected to create two distinct sets of structures. One was functi...
We report the design, fabrication, and characterization of ultralight highly emissive structures wit...
In this article we present the status of our new setup to determine coefficients of thermal expansi...
The coefficient of thermal expansion (CTE), biaxial modulus, and stress of some amorphous semiconduc...
We fabricate and characterize bi-metallic structured thin films (~1 um thick) with ultra-low effecti...
We developed micro-structured thin films with ultra-low coefficient of thermal expansion. These low-...
Ultra-low coefficient of thermal expansion (CTE) is an elusive property, and narrow temperature rang...
Microscale bi-material lattices with near zero thermal expansion are designed to create a thermally ...
We design, fabricate, and test thin thermally stable metastructures consisting of bi-metallic unit c...
[[abstract]]The coefficient of thermal expansion (CTE) is an important mechanical property for thin ...
The coefficient of thermal expansion (CTE) of architected materials, as opposed to that of conventio...
The geometry and constituent materials of metastructures can be used to engineer the thermal expansi...
[[abstract]]In this research, the coefficient of thermal expansion (CTE) of thin films was studied t...
Thermal expansion and lattice parameters are investigated up to 1100 degrees C for Ti-6Al-4V compone...
In this work, we study the thermo-mechanical behavior of metallic structures designed to significant...
A range of engineering alloys was selected to create two distinct sets of structures. One was functi...
We report the design, fabrication, and characterization of ultralight highly emissive structures wit...
In this article we present the status of our new setup to determine coefficients of thermal expansi...
The coefficient of thermal expansion (CTE), biaxial modulus, and stress of some amorphous semiconduc...